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CYSTEKEC[Cystech Electonics Corp.]
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Part No. |
CASD501S2
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OCR Text |
... plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek r... |
Description |
Surface Mount Small Signal Schottky Barrier Diodes
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File Size |
130.61K /
3 Page |
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CYSTEKEC[Cystech Electonics Corp.]
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Part No. |
CASD501SG
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OCR Text |
...plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek re... |
Description |
Surface Mount Small Signal Schottky Barrier Diodes
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File Size |
126.24K /
3 Page |
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it Online |
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CYSTEKEC[Cystech Electonics Corp.]
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Part No. |
CDSN4148SE
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OCR Text |
...plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek re... |
Description |
SURFACE MOUNT SWITCHING DIODE
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File Size |
147.51K /
3 Page |
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CYSTEKEC[Cystech Electonics Corp.]
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Part No. |
CDSS355CY
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OCR Text |
...plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek re... |
Description |
75V/150mA SURFACE MOUNT SWITCHING DIODE
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File Size |
142.38K /
3 Page |
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PANASONIC[Panasonic Semiconductor]
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Part No. |
CNA1311K
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OCR Text |
...e integrated in a double molded resin package.
(1.8) 4.0 1.0 A
With gate A Side or B Side Optical center 2.6 (C0.5)
1.5
1.5
Slit width (0.15)
5.0 min. 3.3 2.3
(0.9)
1.5
2-0.4 A' *3.0 1 3 *2.0
Features
Ultramin... |
Description |
Photo Interrupter
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File Size |
59.89K /
3 Page |
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PANASONIC[Panasonic Semiconductor]
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Part No. |
CNA1312K
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OCR Text |
...e integrated in a double molded resin package.
(1.8)
(1.5) With gate a side or b side
1.45
4.90.3 2.00.3 1.45 A B
Optical center 2.6 (C0.5)
5.0 min. 3.3 2.3
(0.9)
Features
Ultraminiature : 2.6 x 4.9 mm (height : 3.3... |
Description |
Transmissive Photosensors(Photo Interrupters)
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File Size |
60.67K /
3 Page |
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PANASONIC[Panasonic Semiconductor]
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Part No. |
CNZ1002
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OCR Text |
...e integrated in a double molded resin package.
(1.0)
A'
+0.1
Slit width (0.5)
Unit : mm
3.8 -0.2 1.45 0.9 1.45
Device center (C0.3) 2-0.25 *2.54
4.0 min. 5.1 2.8
3.9
Ultraminiature : 4.0 x 3.8 mm (height : 5.1 mm) Fa... |
Description |
Photo Interrupter
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File Size |
59.12K /
3 Page |
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PANASONIC[Panasonic Semiconductor]
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Part No. |
CNZ1120
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OCR Text |
...lded using visible light cutoff resin. The case has no openings, so the photosensor is not easily susceptible to output attenuation resulting from dust or particles
3.0 min.
A' (15.5)
2-0.45 (2.54) SEC. A-A'
2
3 2 3
1
4 1... |
Description |
Photo Interrupter
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File Size |
29.92K /
1 Page |
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it Online |
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PANASONIC[Panasonic Semiconductor]
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Part No. |
CNZ1413
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OCR Text |
...etector chip in a double molded resin package.
A'
,,, ,
(1.5)
Overview
1
CNZ1413
Electrical Characteristics (Ta = 25C)
Parameter Forward voltage (DC) Input characteristics Reverse current (DC) "H" Output current "L" Output... |
Description |
Integrated Photosensors
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File Size |
55.81K /
3 Page |
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it Online |
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PANASONIC[Panasonic Semiconductor]
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Part No. |
CNZ1414A
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OCR Text |
...hip wich are in a double molded resin package.
A'
,,, ,
(1.5)
Overview
1
Integrated Photosensors
Electrical Characteristics (Ta = 25C)
Parameter Forward voltage (DC) Input characteristics Reverse current (DC) "H" Output cu... |
Description |
Integrated Photosensor
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File Size |
51.83K /
3 Page |
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it Online |
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Price and Availability
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