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  resin-molded Datasheet PDF File

For resin-molded Found Datasheets File :: 1274    Search Time::3.672ms    
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    CYSTEKEC[Cystech Electonics Corp.]
Part No. CASD501S2
OCR Text ... plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek r...
Description Surface Mount Small Signal Schottky Barrier Diodes

File Size 130.61K  /  3 Page

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    CYSTEKEC[Cystech Electonics Corp.]
Part No. CASD501SG
OCR Text ...plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek re...
Description Surface Mount Small Signal Schottky Barrier Diodes

File Size 126.24K  /  3 Page

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    CYSTEKEC[Cystech Electonics Corp.]
Part No. CDSN4148SE
OCR Text ...plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek re...
Description SURFACE MOUNT SWITCHING DIODE

File Size 147.51K  /  3 Page

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    CYSTEKEC[Cystech Electonics Corp.]
Part No. CDSS355CY
OCR Text ...plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek re...
Description 75V/150mA SURFACE MOUNT SWITCHING DIODE

File Size 142.38K  /  3 Page

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    PANASONIC[Panasonic Semiconductor]
Part No. CNA1311K
OCR Text ...e integrated in a double molded resin package. (1.8) 4.0 1.0 A With gate A Side or B Side Optical center 2.6 (C0.5) 1.5 1.5 Slit width (0.15) 5.0 min. 3.3 2.3 (0.9) 1.5 2-0.4 A' *3.0 1 3 *2.0 Features Ultramin...
Description Photo Interrupter

File Size 59.89K  /  3 Page

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    PANASONIC[Panasonic Semiconductor]
Part No. CNA1312K
OCR Text ...e integrated in a double molded resin package. (1.8) (1.5) With gate a side or b side 1.45 4.90.3 2.00.3 1.45 A B Optical center 2.6 (C0.5) 5.0 min. 3.3 2.3 (0.9) Features Ultraminiature : 2.6 x 4.9 mm (height : 3.3...
Description Transmissive Photosensors(Photo Interrupters)

File Size 60.67K  /  3 Page

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    PANASONIC[Panasonic Semiconductor]
Part No. CNZ1002
OCR Text ...e integrated in a double molded resin package. (1.0) A' +0.1 Slit width (0.5) Unit : mm 3.8 -0.2 1.45 0.9 1.45 Device center (C0.3) 2-0.25 *2.54 4.0 min. 5.1 2.8 3.9 Ultraminiature : 4.0 x 3.8 mm (height : 5.1 mm) Fa...
Description Photo Interrupter

File Size 59.12K  /  3 Page

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    PANASONIC[Panasonic Semiconductor]
Part No. CNZ1120
OCR Text ...lded using visible light cutoff resin. The case has no openings, so the photosensor is not easily susceptible to output attenuation resulting from dust or particles 3.0 min. A' (15.5) 2-0.45 (2.54) SEC. A-A' 2 3 2 3 1 4 1...
Description Photo Interrupter

File Size 29.92K  /  1 Page

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    PANASONIC[Panasonic Semiconductor]
Part No. CNZ1413
OCR Text ...etector chip in a double molded resin package. A' ,,, , (1.5) Overview 1 CNZ1413 Electrical Characteristics (Ta = 25C) Parameter Forward voltage (DC) Input characteristics Reverse current (DC) "H" Output current "L" Output...
Description Integrated Photosensors

File Size 55.81K  /  3 Page

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    PANASONIC[Panasonic Semiconductor]
Part No. CNZ1414A
OCR Text ...hip wich are in a double molded resin package. A' ,,, , (1.5) Overview 1 Integrated Photosensors Electrical Characteristics (Ta = 25C) Parameter Forward voltage (DC) Input characteristics Reverse current (DC) "H" Output cu...
Description Integrated Photosensor

File Size 51.83K  /  3 Page

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For resin-molded Found Datasheets File :: 1274    Search Time::3.672ms    
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