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For shrink Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    162-10-428-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-428-00-180000
Description DIP Header Solder Tail shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.38K  /  2 Page

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    162-10-668-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-668-00-180000
Description DIP Header Solder Tail shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.38K  /  2 Page

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    162-10-430-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-430-00-180000
Description DIP Header Solder Tail shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.39K  /  2 Page

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    162-10-648-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-648-00-180000
Description DIP Header Solder Tail shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.38K  /  2 Page

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Part No. MTC16
Description 16 Lead Molded Thin shrink Small Outline Package, JEDEC NS Package Number MTC16

File Size 51.45K  /  1 Page

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    162-10-640-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-640-00-180000
Description DIP Header Solder Tail shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.39K  /  2 Page

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    162-10-620-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-620-00-180000
Description DIP Header Solder Tail shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.37K  /  2 Page

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    19269-0239 19294-0062 19413-0042 64005-7400 64001-7400 76650-0026

MolexKits
Part No. 19269-0239 19294-0062 19413-0042 64005-7400 64001-7400 76650-0026
Description Assorted Sealed Quick Disconnect, Ring and Butt Splice Terminals. Includes Heat shrink Tubing and Cable Ties, With Universal Crimp Tool

File Size 30.58K  /  2 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. KM416S8030BN-G/FH KM416S8030BN-G/FL
Description 128Mb SDRAM shrink TSOP 2M x 16Bit x 4 Banks Synchronous DRAM LVTTL 128MbSDRAM的收缩的TSOP 200万16 × 4银行同步DRAM LVTTL

File Size 55.29K  /  9 Page

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    INTERSIL[Intersil Corporation]
Part No. M24.173B
Description Thin shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP) 薄小外形Wxposed垫塑料封装(EPTSSOP
From old datasheet system

File Size 39.10K  /  1 Page

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