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  SX55-3503 Datasheet PDF File

For SX55-3503 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    ATS035035004-MF-11C

Advanced Thermal Solutions, Inc.
Part No. ATS035035004-MF-11C
Description 35.00 x 35.00 x 4.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 279.99K  /  1 Page

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Amphenol Communications Solutions

Part No. 76350-310-24LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 24 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    ATS035035010-MF-11I

Advanced Thermal Solutions, Inc.
Part No. ATS035035010-MF-11I
Description 35.00 x 35.00 x 10.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 279.99K  /  1 Page

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Amphenol Communications Solutions

Part No. 76350-304-72LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 72 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    ATS035035009-MF-11H

Advanced Thermal Solutions, Inc.
Part No. ATS035035009-MF-11H
Description 35.00 x 35.00 x 9.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 279.92K  /  1 Page

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Amphenol Communications Solutions

Part No. 76350-304-24LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 24 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    ATS035035019-PF-11R

Advanced Thermal Solutions, Inc.
Part No. ATS035035019-PF-11R
Description 35.00 x 35.00 x 19.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin

File Size 249.93K  /  1 Page

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Amphenol Communications Solutions

Part No. 76350-304-20LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 20 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    ATS035035003-SF-11B

Advanced Thermal Solutions, Inc.
Part No. ATS035035003-SF-11B
Description 35.00 x 35.00 x 3.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 278.14K  /  1 Page

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Amphenol Communications Solutions

Part No. 76350-304-10LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 10 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    ATS035035008-SF-11G

Advanced Thermal Solutions, Inc.
Part No. ATS035035008-SF-11G
Description 35.00 x 35.00 x 8.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 277.91K  /  1 Page

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Amphenol Communications Solutions

Part No. 10117863-5036020LF
Description RJ45 Modular Jack Connector, Input Output Connectors, CAT 3, Standard, 8P8C, Right Angle, Through Hole, With Shield, Snap Peg, 1 Port
Tech specs    

Official Product Page

    ATS035035010-SF-11I

Advanced Thermal Solutions, Inc.
Part No. ATS035035010-SF-11I
Description 35.00 x 35.00 x 10.00 BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 278.15K  /  1 Page

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Amphenol Communications Solutions

Part No. 10152535-0311K13LF
Description DDR4 Memory Module Sockets,Vertical, Surface Mount, 288 Position, 0.85mm (0.0335in) pitch, 30u\\ Gold on Contact Area, Standard Housing and Latch, Metal tab, Without MYLAR
Tech specs    

Official Product Page

    ATS035035020-SF-11S

Advanced Thermal Solutions, Inc.
Part No. ATS035035020-SF-11S
Description 35.00 x 35.00 x 20.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 277.92K  /  1 Page

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Amphenol Communications Solutions

Part No. 76350-304-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 36 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    ATS035035002-SF-11A

Advanced Thermal Solutions, Inc.
Part No. ATS035035002-SF-11A
Description 35.00 x 35.00 x 2.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 278.08K  /  1 Page

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Amphenol Communications Solutions

Part No. 77313-503-40LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 40 Positions
Tech specs    

Official Product Page

    ATS035035003-MF-11B

Advanced Thermal Solutions, Inc.
Part No. ATS035035003-MF-11B
Description 35.00 x 35.00 x 3.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 279.90K  /  1 Page

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Amphenol Communications Solutions

Part No. 76350-304-04LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 4 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

For SX55-3503 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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