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  tin lead Datasheet PDF File

For tin lead Found Datasheets File :: 31968    Search Time::2.719ms    
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    PZT751T1 ON2781 PZT751T1_D PZT751T3

MOTOROLA INC
ON Semi
MOTOROLA[Motorola, Inc]
Part No. PZT751T1 ON2781 PZT751T1_D PZT751T3
OCR Text ...type of solder used was 62/36/2 tin lead Silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then ...
Description 2000 mA, 60 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-261AA
SOT-223 PACKAGE HIGH CURRENT PNP SILICON TRANSISTOR SURFACE MOUNT
From old datasheet system

File Size 119.34K  /  6 Page

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    TDA8011 TDA8011T

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. TDA8011 TDA8011T
OCR Text ...by dipping or by an extra thick tin/lead plating before package placement. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published lat...
Description IF amplifier for satellite TV receivers

File Size 74.46K  /  12 Page

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    X1228S14 X1228S14-2.7 X1228S14-2.7A X1228S14-4.5A X1228S14I X1228S14I-2.7 X1228S14I-2.7A X1228S14I-4.5A X1228V14 X1228V1

XICOR[Xicor Inc.]
Part No. X1228S14 X1228S14-2.7 X1228S14-2.7A X1228S14-4.5A X1228S14I X1228S14I-2.7 X1228S14I-2.7A X1228S14I-4.5A X1228V14 X1228V14-2.7 X1228V14-2.7A X1228V14-4.5A X1228V14I X1228V14I-2.7 X1228V14I-2.7A X1228V14I-4.5A X1228
OCR Text ...erwise specified.) Symbol fSCL tin tAA tBUF tLOW tHIGH tSU:STA tHD:STA tSU:DAT tHD:DAT tSU:STO tDH tR tF Cb SCL Clock Frequency Pulse width Suppression Time at inputs SCL LOW to SDA Data Out Valid Time the bus must be free before a new tra...
Description Real Time Clock/Calendar/CPU Supervisor with EEPROM

File Size 563.57K  /  31 Page

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    2211-1500G 2211 2211-1000D 2211-1000G 2211-100A 2211-100B 2211-100D 2211-1200G 2211-120C 2211-150A 2211-150D 2211-2000G

Data Delay Devices, Inc.
ETC
Part No. 2211-1500G 2211 2211-1000D 2211-1000G 2211-100A 2211-100B 2211-100D 2211-1200G 2211-120C 2211-150A 2211-150D 2211-2000G 2211-200A 2211-200B 2211-200C 2211-200D 2211-200G 2211-250D 2211-300B 2211-300C 2211-300D 2211-300G 2211-400B 2211-400C 2211-400D 2211SERIES 2211-600C 2211-600D 2211-600G 2211-60A 2211-60B
OCR Text ... Material: Nickel-Iron alloy 42 tin PLATE .280 MAX. .015 TYP. .018 TYP. 1.100.010 11 Equal spaces each .100.010 Non-Accumulative .070 MAX. DIP (2214-xxz) .020 TYP. .040 TYP. .010.002 24 23 22 21 20 19 18 17 16 15 14 13 ...
Description Delay 1000
FIXEDDIPDELAYLINE
FIXED DIP DELAY LINE TD/TR = 10

File Size 41.23K  /  3 Page

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    2214-1500G 2214 2214-80C 2214-1000D 2214-1000G 2214-100A 2214-100B 2214-100D 2214-1200G 2214-120C 2214-150A 2214-150B 22

HIROSE ELECTRIC Co., Ltd.
Electronic Theatre Controls, Inc.
Data Delay Devices Inc
ETC[ETC]
List of Unclassifed Manufacturers
Part No. 2214-1500G 2214 2214-80C 2214-1000D 2214-1000G 2214-100A 2214-100B 2214-100D 2214-1200G 2214-120C 2214-150A 2214-150B 2214-150D 2214-2000G 2214-200A 2214-200B 2214-200C 2214-200D 2214-200G 2214-250D 2214-300B 2214-300C 2214-300D 2214-300G 2214-400B 2214-400C 2214-400D 2214-400G 2214-40C 2214-500C 2214-500D 2214-500G 2214-50A 2214-50B 2214-50D 2214-600C 2214-600D 2214-600G 2214-60A 2214-60B 2214-800C 2214-800D 2214-800G 2214-80A 2214-80B 2214SERIES
OCR Text ... Material: Nickel-Iron alloy 42 tin PLATE .280 MAX. .015 TYP. .018 TYP. 1.100.010 11 Equal spaces each .100.010 Non-Accumulative .070 MAX. DIP (2214-xxz) .020 TYP. .040 TYP. .010.002 24 23 22 21 20 19 18 17 16 15 14 13 ...
Description 64K Nonvolatile SRAM 20 - TAP在双酯延迟线运输训练班\u003d 10
20-TAP DIP DELAY LINE TD/TR = 10 (SERIES 2214) 20 - TAP在双酯延迟线运输训练班\u003d 10(系214
20-TAP DIP DELAY LINE TD/TR = 10 (SERIES 2214) 20 - TAP在双酯延迟线运输训练班\u003d 10(系2214
20-TAPDIPDELAYLINETD/TR=10(SERIES2214)

File Size 50.80K  /  3 Page

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    MBRB2515 MBRB2515L ON0436

MOTOROLA[Motorola, Inc]
MOTOROLA[Motorola Inc]
Part No. MBRB2515 MBRB2515L ON0436
OCR Text ...type of solder used was 62/36/2 tin lead Silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then ...
Description SWITCHMODE⑩ Power Rectifier D2PAK Surface Mount Power Package
From old datasheet system
SWITCHMODE Power Rectifier D2PAK Surface Mount Power Package

File Size 97.78K  /  6 Page

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    MBRB2535CTL MBRB2535CTL_D ON0437

GOOD-ARK Electronics
ON Semi
Motorola, Inc
Part No. MBRB2535CTL MBRB2535CTL_D ON0437
OCR Text ...type of solder used was 62/36/2 tin lead Silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then ...
Description SWITCHMODE⑩ Power Rectifier D2PAK Surface Mount Power Package
From old datasheet system
25 AMPERES 35 VOLTS
SWITCHMODE Power Rectifier D2PAK Surface Mount Power Package

File Size 102.42K  /  6 Page

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    MBRB2545CT MBRB2545CT_D ON0438

MOTOROLA[Motorola, Inc]
ON Semi
Part No. MBRB2545CT MBRB2545CT_D ON0438
OCR Text ...type of solder used was 62/36/2 tin lead Silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then ...
Description SWITCHMODE⑩ Power Rectifier D2PAK Surface Mount Power Package
From old datasheet system
30 AMPERES 45 VOLTS
SWITCHMODE Power Rectifier D2PAK Surface Mount Power Package

File Size 106.64K  /  6 Page

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    PACKBMU PACKBMUQ PACKBMUR

CALMIRCO[California Micro Devices Corp]
Part No. PACKBMU PACKBMUQ PACKBMUR
OCR Text ...rial Body Material Flammability tin-lead Copper Allowy 0.004" (0/102mm) Silicon Molded Expoxy UL94V-0 PACKAGE DIMENSIONS, POWER DISSIPATION, & INFORMATION Package Pins JEDEC mm min A A1 B C D E e H L PD @ 70C #/tube #/tape & reel 1.35 0...
Description KEYBOARD/ MOUSE/ AND USB FILTER AND PROTECTION MODULE
KEYBOARD, MOUSE, AND USB FILTER AND PROTECTION MODULE

File Size 138.19K  /  3 Page

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    1N5820US 1N5822US JS5822US JX5822US 1N5821US J5822US JV5822US

Compensated Devices Incorporated
CDI-DIODE[Compensated Deuices Incorporated]
Compensated Deuices Inc...
Part No. 1N5820US 1N5822US JS5822US JX5822US 1N5821US J5822US JV5822US
OCR Text ... MIL-PRF 19500/620 lead FINISH: tin / lead THERMAL RESISTANCE: (ROJEC): 10 C/W maximum at L = 0 inch THERMAL IMPEDANCE: (ZOJX): 3 C/W maximum POLARITY: Cathode end is banded. MOUNtinG SURFACE SELECTION: The Axial Coefficient of Expansion (C...
Description 3 AMP SCHOTTKY BARRIER RECTIFIERS

File Size 39.26K  /  2 Page

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For tin lead Found Datasheets File :: 31968    Search Time::2.719ms    
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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