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Toshiba Electronic Devices & Storage Corporation |
Part No. |
TC4001BP
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Description |
CMOS Logic IC, 2-Input/AND, DIP14
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0702463004 70246-3004
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Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC Tail Plating 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating
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File Size |
176.00K /
4 Page |
View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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Part No. |
0702463002 70246-3002
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Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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File Size |
175.77K /
4 Page |
View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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Part No. |
0702462002 70246-2002
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Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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File Size |
175.77K /
4 Page |
View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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Part No. |
70246-2602 0702462602
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Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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File Size |
175.78K /
4 Page |
View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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Part No. |
70246-2601 0702462601
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Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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File Size |
175.77K /
4 Page |
View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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Part No. |
0702462001 70246-2001
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Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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File Size |
175.77K /
4 Page |
View
it Online |
Download Datasheet
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Bom2Buy.com

Price and Availability
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