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  87759-4051 Datasheet PDF File

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    87759-4276

Molex Electronics Ltd.
Part No. 87759-4276
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 355.72K  /  6 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. 74HC4051FT
Description CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC
Tech specs 　 　

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HUA FENG CIRCUIT





    87759-0876

Molex Electronics Ltd.
Part No. 87759-0876
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 355.72K  /  6 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. 74VHC4051AFT
Description CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC, AEC-Q100
Tech specs 　 　

Official Product Page

    87759-4876

Molex Electronics Ltd.
Part No. 87759-4876
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 355.72K  /  6 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. 74HC4051D
Description CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, SOIC16, -40 to 125 degC
Tech specs 　 　

Official Product Page

    87759-3876

Molex Electronics Ltd.
Part No. 87759-3876
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 355.72K  /  6 Page

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Rochester Electronics LLC
Part No. HI4-0516-8/B
Description HI4-0516 - Differential Multiplier
Tech specs 　 　

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    87759-4274

Molex Electronics Ltd.
Part No. 87759-4274
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
File Size 421.12K  /  8 Page

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Amphenol Communications Solutions
Part No. 10136654-0511LF
Description Minitek® Pwr 3.0, Single Row, Right Angle Through Hole Header, Tin plating, 5 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

    87759-3864

Molex Electronics Ltd.
Part No. 87759-3864
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging
File Size 420.91K  /  8 Page

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Amphenol Communications Solutions
Part No. G832MB010405122HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 7.7 mm, 40 Positions, Dual Row, BTB Vertical Receptacle SMT, 15u\\ Gold Black.
Tech specs 　 　

Official Product Page

    87759-4874

Molex Electronics Ltd.
Part No. 87759-4874
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
File Size 421.12K  /  8 Page

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Amphenol Communications Solutions
Part No. 68405-130HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    87759-1465

Molex Electronics Ltd.
Part No. 87759-1465
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs,
File Size 280.39K  /  6 Page

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Amphenol Communications Solutions
Part No. 68405-172
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    87759-1464

Molex Electronics Ltd.
Part No. 87759-1464
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 421.26K  /  8 Page

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Amphenol Communications Solutions
Part No. 68405-140HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    87759-4075

Molex Electronics Ltd.
Part No. 87759-4075
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size 279.39K  /  6 Page

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Amphenol Communications Solutions
Part No. 68405-154HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 54 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

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