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Amphenol Communications Solutions |
Part No. |
87900-158HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
15-80-0143 0015800143
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat Molex Electronics Ltd.
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File Size |
1,218.47K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
0015800163 15-80-0163
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
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File Size |
1,218.30K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
15-80-0123 0015800123
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat Molex Electronics Ltd.
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File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet |
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Bom2Buy.com
Price and Availability
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