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Advanced Micro Devices, Inc. ADVANCED MICRO DEVICES INC
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Part No. |
AM29LV002BB-55REI AM29LV002BB-55REC AM29LV002BB-55RFC AM29LV002BB-120EI AM29LV002BB-70EI AM29LV002BT-70EI AM29LV002BT-90EI AM29LV002BT-55REI AM29LV002BT-120EI AM29LV002BT-55RFI AM29LV002BT-55RFC AM29LV002BB-55RFI AM29LV002BB-120EC AM29LV002BB-120EE AM29LV002BT-70FC AM29LV002BT-90EC AM29LV002BB-70FI AM29LV002BT-55REC AM29LV002BT-90FI AM29LV002BB-90EC AM29LV002BT-90FE AM29LV002BT-70EC AM29LV002BB-70FE AM29LV002BB-70FC AM29LV002BB-120FE AM29LV002BB-90FE AM29LV002BT-120EC
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Description |
Ballast Control, Below Resonance Protection, Thermal Overload Protection, Protection from Failure to Strike, Programmable Preheat Time and Run Frequency, Programmable Deadtime in a 16-pin DIP package Half Bridge Driver, LO In Phase with RT, Programmable Oscillating Frequency, 1.2us Deadtime in a 8-lead SOIC package PFC Ballast Control, Thermal Overload Protection, Brown Out Protection, Programmable Preheat and Frequency, Programmable Deadtime in a 20 Lead DIP package Fully Protected H-Bridge for DC Motor in a 20 Lead SOIC package Intelligent Power Switch 1 Channel High Side Driver in a D2-Pak 5-Lead Package Not recommended for new designs. For new designs, we recommend IR3086AM. Not recommended for new designs. For new designs, we recommend IR3081AM. Not recommended for new designs. For new designs, we recommend IR3088A. Ballast Control, Below Resonance Protection, Thermal Overload Protection, Protection from Failure to Strike, Programmable Preheat Time and Run Frequency, Programmable Deadtime in a 16-lead SOIC Narrow package Half Bridge Driver, LO In Phase with RT, Programmable Oscillating Frequency, 1.2us Deadtime in a 8-pin DIP package with bootstrap diode IR2170 is not recommended for new designs. Controller IC; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Reel Quantity:3000 RoHS Compliant: Yes 400V Self-Oscilliating Half-Bridge Hybrid MOSFET and Gate Driver in a 9 Lead SIP w/o #5and8 package Single Supply RS232C Line Driver/Receiver(?????μ?o?RS232C ?o?????????¨???2???2??????) 250V Self-Oscilliating Half-Bridge Hybrid MOSFET and Gate Driver in a 9 Lead SIP w/o #5and8 package Controller IC; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes IR2170S is not recommended for new designs. PFC Ballast Control, Thermal Overload Protection, Brown Out Protection, Programmable Preheat and Frequency, Programmable Deadtime in a 20 Lead SOIC package MOSFET Driver IC; Driver Type:High-Side; Package/Case:8-SOIC; Leaded Process Compatible:No; No. of Drivers:1; Offset Voltage:600V; Peak Reflow Compatible (260 C):No; Reel Quantity:2500; Sink Output Current:20mA RoHS Compliant: No x8闪存EEPROM 2 Mb (256K x 8) Boot Sector, Flash Memory 256K X 8 FLASH 3V PROM, 90 ns, PDSO40 256K X 8 FLASH 3V PROM, 55 ns, PDSO40
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File Size |
469.62K /
39 Page |
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Spansion, Inc. GE Security, Inc. Amphenol, Corp. STMicroelectronics N.V. Lattice Semiconductor, Corp.
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Part No. |
AM29SL800CB-100WBI AM29SL800CT-100WBC AM29SL800CT-100WBI AM29SL800CB-100WBC AM29SL800CB-150EI AM29SL800CT-150EI AM29SL800CB-100FI AM29SL800CB-120WBC AM29SL800CB-100EC AM29SL800CB-100FC AM29SL800CT-100EI AM29SL800CT-120EI AM29SL800CB-150EC AM29SL800CB-150FC
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Description |
10MS, 8 TSSOP, IND TEMP, GREEN, 2.7V(SERIAL EE) x8/x16闪存EEPROM x8/x16 Flash EEPROM x8/x16闪存EEPROM 10MS, 8 PDIP, IND TEMP, GREEN, 2.7V(SERIAL EE) x8/x16闪存EEPROM 10MS, 8 SOIC, IND TEMP, GREEN, 1.8V(SERIAL EE) x8/x16闪存EEPROM
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File Size |
649.06K /
43 Page |
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Analog Devices, Inc. ADVANCED MICRO DEVICES INC
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Part No. |
AM29LV800BB-120WBI AM29LV800BB-120WBC AM29LV800BB-120EI AM29LV800BT-90FI AM29LV800BT-120FC AM29LV800BT-120WBC AM29LV800BB-120SE AM29LV800BB-120FC AM29LV800BB-120EC AM29LV800BB-120EE AM29LV800BB-90WBC AM29LV800BT-90EE AM29LV800BT-90FC AM29LV800BB-70FI AM29LV800BB-120SI AM29LV800BB-90EE AM29LV800BB-120FI AM29LV800BB-120FE AM29LV800BT-120EI
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Description |
30MHZ, 3.3V, 44 TQFP, IND TEMP(FPGA) 30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA) 30MHZ, 3.3V, 20 PLCC, IND TEMP(FPGA) 8-TSSOP,AUTO,Pb/HALO FREE,NIPDAU LF 2.5V(SERIAL EE) 10MHZ, 20 SOIC, COM TEMP, 5K MOQ(FPGA) 10MHZ, 20 SOIC, IND TEMP, 5K MOQ(FPGA) 30MHZ, 3.3V, 44 PLCC, COM TEMP(FPGA) 30MHZ, 3.3V, 44 TQFP, COM TEMP(FPGA) 30MHZ, 8 LAP, IND TEMP, GREEN(FPGA) x8/x16闪存EEPROM x8/x16 Flash EEPROM x8/x16闪存EEPROM 32M CONFIG FLASH, 44 PLCC, GREEN(FPGA) x8/x16闪存EEPROM 512K X 16 FLASH 3V PROM, 120 ns, PDSO44 512K X 16 FLASH 3V PROM, 120 ns, PDSO48 10MHZ, 8 PDIP, COM TEMP, 5K MOQ(FPGA)
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File Size |
771.49K /
45 Page |
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it Online |
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Rochester Electronics, LLC Amphenol, Corp. Advanced Micro Devices, Inc.
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Part No. |
AM29F400B-75FC AM29F400B-75SC AM29F400B-75EC AM29F400B-90SC AM29F400T-150SI AM29F400T-150SE AM29F400T-150SC AM29F400T-150SEB AM29F400T-150FI AM29F400T-75EC AM29F400T-120EC AM29F400T-90EC AM29F400T-150EC AM29F400B-90FI AM29F400B-150EEB AM29F400B-120EEB AM29F400B-120SEB AM29F400B-90SEB AM29F400B-150SEB AM29F400T-120EI AM29F400B-150EC AM29F400B-150EI AM29F400B-90FE AM29F400B-90EE AM29F400T-120EE AM29F400T-120EEB AM29F400B-150FI AM29F400T-90EEB AM29F400T-90FE AM29F400T-90FEB AM29F400T-75FC
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Description |
60V Single N-Channel HEXFET Power MOSFET in a TO-247AC package; Similar to IRFP064V with Lead Free Packaging 55V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRFZ24N with Standard Packaging 100V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU120N with Lead Free Packaging 60V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRF1010EL with Standard Packaging 100V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3710ZS with Lead Free Packaging 55V Single N-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRFZ46NL with Lead Free Packaging 55V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; Similar to the IRF1010N with Lead-Free Packaging. 30V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3709 with Lead Free Packaging 30V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7466 with Lead Free Packaging 100V Single N-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR3412 with Standard Packaging 55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRL2505S with Standard Packaging 100V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3911 with Lead Free Packaging 40V Single N-Channel Automotive HEXFET Power MOSFET in a TO-220AB package; Similar to IRF4104 with Lead Free Packaging x8/x16闪存EEPROM 30V Single N-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRLR3303 with Lead Free Packaging x8/x16闪存EEPROM x8/x16 Flash EEPROM x8/x16闪存EEPROM 55V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRLZ24N with Standard Packaging x8/x16闪存EEPROM 30V Single N-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRLR7821 with Lead Free Packaging 30V Single N-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRF3707ZCL with Lead Free Packaging 30V Single N-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRL8113L with Lead Free Packaging 40V Single N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7484 with Standard Packaging 100V Single N-Channel HEXFET Power MOSFET in a I-Pak package; A IRFU3910 with Standard Packaging 100V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3910 with Lead Free Packaging 80V Single N-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRLR2908 with Lead Free Packaging
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File Size |
1,107.28K /
37 Page |
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it Online |
Download Datasheet |
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