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NEC Corp.
NEC, Corp.
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| Part No. |
EF2-1.5NU EF2-1.5T EF2-1.5TNUX EF2-12NUH EF2-12TNUH EF2-24NUN EF2-24S EF2-24SNUH EF2-1.5NUH EF2-1.5NUN EF2-1.5NUX EF2-1.5S EF2-1.5SNU EF2-1.5SNUH EF2-1.5SNUN EF2-1.5SNUX EF2-1.5TNUH EF2-1.5TNUN EF2-12NUN EF2-12S EF2-12SNUX EF2-12TNUN EF2-12TNUX EF2-24NUH EF2-24NUX EF2-24SNUX EF2-12NUX EF2-12SNUH EF2-12SNUN EF2-24SNUN ED2-24 ED2-12 ED2-4.5 EF2-3NUN ED2-3 ED2-1.5S ED2-12NJ ED2-1.5T ED2-9 EF2-9 ED2-4.5NJ ED2-4.5SNJ ED2-4.5TNJ EF2-5 ED2-5 ED2-1.5TNU ED2-1.5TNJ EF2-5S EF2-6 ED2-5S EF2-4.5NUH ED2-3NU ED2-4.5TNU ED2-5T ED2-6 ED2-5TNJ ED2-5SNJ ED2-5TNU EF2-4.5T ED2-3NJ EF2-5T ED2-9TNU ED2-9TNJ EF2-9T EF2-3S EF2-3T ED2-24SNU ED2-24SNJ ED2-12S EF2-24TNUX ED2-3TNJ ED2-6TNU ED2-3TNU ED2-9SNJ EF2-9SNUX EF2-9TNUX ED2-12NU ED2-12SNJ ED2-12SNU ED2-12T ED2-12TNJ ED2-12TNU ED2-1.5SNJ EF2-9NUX ED2-1.5SNU ED2-6SNJ ED2-3SNJ ED2-5SNU ED29SNU
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| Description |
Ultra-low power/ compact and lightweight/ High breakdown voltage/ Surface mounting type
A/D Converter (A-D) IC; Resolution (Bits):24; ADC Sample Rate:192kSPS; Input Channels Per ADC:2; Input Channel Type:Differential Inputs; Data Interface:Serial; Package/Case:24-SOIC; Interface Type:Serial
POWER/ENERGY MEASURE, SMD, SSOP28; Pins, No. of:28; Case style:SSOP; Base number:5467; Termination Type:SMD RoHS Compliant: Yes
Marker Strip; External Height:.135"; External Width:1.13"; Label Material:Vulcanized Fiber 超低功耗，结构紧凑，重量轻，高击穿电压，表面安装型
Ultra-low power, compact and lightweight, High breakdown voltage, Surface mounting type 超低功耗，结构紧凑，重量轻，高击穿电压，表面安装型
CONNECTOR ACCESSORY 连接器附
Ultra-low power, compact and lightweight, High breakdown voltage, Surface mounting type
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| File Size |
154.18K /
16 Page |
 View
it Online |
Download Datasheet
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TY Semiconductor Co., Ltd
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| Part No. |
HSM88AS
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| Description |
MPAK package is suitable for high density surface mounting and high speed assembly
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| File Size |
55.86K /
1 Page |
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it Online |
Download Datasheet |
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TY Semiconductor Co., Ltd
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| Part No. |
HSM107S
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| Description |
MPAK package is suitable for high density surface mounting and high speed assembly.
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| File Size |
83.41K /
1 Page |
View
it Online |
Download Datasheet |
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TY Semiconductor Co., Ltd
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| Part No. |
HSM88WA
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| Description |
MPAK package is suitable for high density surface mounting and high speed assembly
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| File Size |
56.08K /
1 Page |
View
it Online |
Download Datasheet |
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TY Semiconductor Co., Ltd
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| Part No. |
HSB88WA
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| Description |
CMPAK package is suitable for high density surface mounting and high speed assembly
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| File Size |
66.14K /
1 Page |
View
it Online |
Download Datasheet |
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TY Semiconductor Co., Ltd
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| Part No. |
HSU88
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| Description |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
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| File Size |
54.11K /
1 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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