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  CY8C3666AXI-037 Datasheet PDF File

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    Molex, Inc.
Part No. 39-34-3037
Description MiniFit Jr RA Pegs/Rmp Tin V-0 3Ckt 3 CONTACT(S), MALE, POWER CONNECTOR, SOLDER

File Size 516.42K  /  4 Page

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HUA FENG CIRCUIT





    22-28-0037

Molex Electronics Ltd.
Part No. 22-28-0037
Description 2.54mm (.100) Pitch KK庐 Header, Breakaway, Vertical, with Friction Lock, 3 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, with Backwalls Removed
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Backwalls Removed

File Size 237.04K  /  14 Page

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    MSA-0370

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. MSA-0370
Description Cascadable Silicon Bipolar MMIC Amplifiers

File Size 44.86K  /  4 Page

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    MSA-0370

Agilent(Hewlett-Packard)
Part No. MSA-0370
Description Cascadable Silicon Bipolar MMIC Amplifier(可级联的硅双极型单片式微波集成电路放大器)

File Size 37.44K  /  4 Page

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    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CPT-18-6037
Description Temperature Compensated Power Amplifier

File Size 868.70K  /  2 Page

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    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CPA-18-6037
Description Power Amplifier 6 GHz - 18 GHz

File Size 868.65K  /  2 Page

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    Tamura Corporation
Part No. TTC-5037
Description
File Size 265.50K  /  1 Page

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    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CPA-13-6037
Description Power Amplifier 6 GHz - 12 GHz

File Size 868.67K  /  2 Page

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    034-1037

Amphenol Corporation
Part No. 034-1037
Description HD-BNC STR PLUG FOR BI855 ENH/DRAKA 0.6 / 2.8 AF

File Size 141.49K  /  1 Page

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    571-4037

CAMBION Electronic Components
Part No. 571-4037
Description Insulated solder terminal, Pin type

File Size 23.80K  /  1 Page

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Part: CY8C3666AXI-037
Maker: Cypress Semiconductor Corp
Pack: ETC
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