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V2604 MA153 MAX3107E P4SMA DGGYQ X9C104PM SMAJ160 34063AD
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For substrate Found Datasheets File :: 22063    Search Time::1.407ms    
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    EB201 EB201D

ONSEMI[ON Semiconductor]
Part No. EB201 EB201D
OCR Text ... JFET, accumulation region, and substrate resistances. To achieve ultra-low RDS(on), device designers must decrease the resistance of all these components. Most of the resistive elements can be reduced by shrinking cell size and adding more...
Description High Cell Density MOSFETs Low On-Resistance Affords New Design Options

File Size 118.47K  /  8 Page

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    HLCP-A100 HLCP-B100 HLCP-C100 HLCP-D100 HLCP-E100 HLCP-F100 HLCP-G100 HLCP-H100 HLMP-2500 HLMP-2550 HLMP-2885 HLMP-2450

AVAGO TECHNOLOGIES LIMITED
AVAGO TECHNOLOGIES LIMI...
Part No. HLCP-A100 HLCP-B100 HLCP-C100 HLCP-D100 HLCP-E100 HLCP-F100 HLCP-G100 HLCP-H100 HLMP-2500 HLMP-2550 HLMP-2885 HLMP-2450 HLCP-H100-00000 HLMP-2835 HLMP-2655 HLMP-2300 HLMP-2350 HLMP-2400 HLMP-2600 HLMP-2620 HLMP-2965 HLMP-2950 HLMP-2700 HLMP-2800 HLMP-2770 HLMP-2870 HLMP-2635 HLMP-2720 HLMP-2735 HLMP-2820 HLMP-2855 HLMP-2685
OCR Text ...heterojunction AlGaAs on a GaAs substrate. The HER HLMP-2300/2600 and Yellow HLMP-2400/2700 series LEDs have their p-n junctions diffused into a GaAsP epitaxial layer on a GaP substrate. The Green HLMP2500/2800 series LEDs use a liquid phas...
Description    LED Light Bars
Large bright, uniform light emitting areas
SINGLE COLOR LED, RED, 19.05 mm

File Size 336.46K  /  16 Page

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    RA13H8891MA RA13H8891MA-101

Mitsubishi Electric Semiconductor
Part No. RA13H8891MA RA13H8891MA-101
OCR Text ...s module consists of an alumina substrate soldered onto a copper flange. For mechanical protection, a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wit...
Description 889-915MHz 13W 12.5V, 2 Stage Amp. For MOBILE RADIO

File Size 92.59K  /  8 Page

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    RA13H8891MB RA13H8891MB-101

Mitsubishi Electric Semiconductor
Part No. RA13H8891MB RA13H8891MB-101
OCR Text ...s module consists of an alumina substrate soldered onto a copper flange. For mechanical protection, a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated wit...
Description RoHS Compliance , 880-915MHz 13W 12.5V, 3 Stage Amp. For MOBILE RADIO

File Size 99.01K  /  8 Page

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    LINER[Linear Technology]
Part No. LTZ1000CH LTZ1000_06 LM399 LT1021 LT1236 LT1389 LTZ1000 LTZ1000A LTZ1000ACH LTZ100006
OCR Text ... JA = 400C/W 3 2 1 Heater to substrate ...................................................35V Collector Emitter Breakdown Q1 ...............................15V Collector Emitter Breakdown Q2 ...............................35V Emitter Bas...
Description    Ultra Precision Reference

File Size 123.72K  /  8 Page

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    TDE3247FP TDE3247FPT TDE3247

STMICROELECTRONICS[STMicroelectronics]
Part No. TDE3247FP TDE3247FPT TDE3247
OCR Text ... Thermal data Junction-ceramic substrate (case glued to substrate) For SO-14 Junction-ceramic substrate (case glued to substrate, substrate temperature maintened constant) For SO-14 90 C/W Rth 65 C/W 4/15 TDE3247 Electric...
Description Interface circuit (relay and lamp driver)

File Size 384.83K  /  15 Page

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    CYD09S36V18 CYD04S36V18 CYD18S18V18 CYD04S18V18 CYD09S18V18 CYD18S36V18

Cypress Semiconductor
Part No. CYD09S36V18 CYD04S36V18 CYD18S18V18 CYD04S18V18 CYD09S18V18 CYD18S36V18
OCR Text ...ed in the 256-Ball FBGA package substrate design. This creates an error in the Variable Impedance Matching (VIM) feature on the FullFlex Dual-Ports, as the effective output driver impedance is halved when both resistors are populated. The w...
Description 18-Mb/9-Mb/4-Mb x36/x18 FullFlex?/a> Dual-Ports
18-Mb/9-Mb/4-Mb x36/x18 FullFlex Dual-Ports
18-Mb/9-Mb/4-Mb x36/x18 FullFlex垄芒 Dual-Ports
18-Mb/9-Mb/4-Mb x36/x18 FullFlex⑩ Dual-Ports

File Size 39.76K  /  2 Page

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    EMC1201 EMC1201-AGZQ-TR EMC1202 EMC1202-AGZQ-TR

SMSC Corporation
Part No. EMC1201 EMC1201-AGZQ-TR EMC1202 EMC1202-AGZQ-TR
OCR Text ... EMC1202 is compatible with CPU substrate diodes. 3.1 Temperature Monitors Thermal diode temperature measurements are based on the change in forward bias voltage (VBE) of a diode when operated at two different currents: where: VBE...
Description Single/Dual Single-Wire Temp Sensor in SOT23-5 Using SMSC BudgetBus Sensor Interface

File Size 590.72K  /  10 Page

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    BB1020DT BB1020DT13 BB1020DT7 BB1020DTLF13 BB1020DTLF7

Bi technologies
Part No. BB1020DT BB1020DT13 BB1020DT7 BB1020DTLF13 BB1020DTLF7
OCR Text ...ick film resistors on a ceramic substrate with ball grid array (BGA) terminals. Resistors and solder balls reside on the same side of the ceramic substrate, resulting in the absolute minimum stray capacitance and inductance. FEATURES * * *...
Description SCSI Termination Resistor network Low Voltage Differential (LVD)

File Size 186.65K  /  2 Page

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For substrate Found Datasheets File :: 22063    Search Time::1.407ms    
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