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Samsung Electronic SAMSUNG[Samsung semiconductor]
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Part No. |
K4R881869D K4R571669D
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OCR Text |
...lit" bank architecture. b."F" - wbga package. c."C" - RDRAM core uses normal power self refresh.
- x18 organization allows ECC configurations or increased storage/bandwidth - x16 organization for low cost applications
Uses Rambus Signa... |
Description |
256/288Mbit RDRAM(D-die)
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File Size |
309.27K /
20 Page |
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Download Datasheet
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SAMSUNG SEMICONDUCTOR CO. LTD.
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Part No. |
K4R571669D
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OCR Text |
...bank architecture . b. ? f ? - wbga package. c. ? c ? - rdram core uses normal power self refresh. figure 1: direct rdram csp package organization speed part number bin i/o freq. mhz t rac (row access time) ns 512kx16x32s a -ct9 1... |
Description |
256/288Mbit RDRAM(D-die)
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File Size |
313.24K /
20 Page |
View
it Online |
Download Datasheet
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DALLAS
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Part No. |
DS32KHZ_DIP
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OCR Text |
...32kHz/DIP DS32kHz-N/DIP DS32kHz/wbga DS32kHz-N/wbga TEMP RANGE 0C to +70C -40C to +85C 0C to +70C -40C to +85C PIN-PACKAGE 14 DIP 14 DIP 36 BGA 36 BGA
PIN CONFIGURATIONS
TOP VIEW
N.C.
1 2 3
DS32kHz
14 13 12 11 10 9 8
N.C. V... |
Description |
32.768kHz Temperature-Compensated Crystal Oscillator
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File Size |
407.71K /
11 Page |
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it Online |
Download Datasheet
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Price and Availability
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