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  44067-1401 Datasheet PDF File

For 44067-1401 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0440672201 44067-2201

Molex Electronics Ltd.
Part No. 0440672201 44067-2201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
MOLEX Connector
File Size 204.11K  /  3 Page

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Rochester Electronics LLC
Part No. TSL1401CCS-RL2
Description TSL1401 - 128 x 1 Linear Sensor Array with hold. Please note, an MOQ and OM of 250 pcs applies.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    44067-1801 0440671801

Molex Electronics Ltd.
Part No. 44067-1801 0440671801
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating
File Size 203.94K  /  3 Page

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Rochester Electronics LLC
Part No. TSL1401CCS
Description TSL1401 - 128 x 1 Linear Sensor Array With Hold
Tech specs 　 　

Official Product Page

    0440672402 44067-2402

Molex Electronics Ltd.
Part No. 0440672402 44067-2402
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-401-00LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 00 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    0440672403 44067-2403

Molex Electronics Ltd.
Part No. 0440672403 44067-2403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 88914-016LF
Description Metral® Accessories, Backplane Connectors, Board-to-Board Keying System Keying Pin, LF.
Tech specs 　 　

Official Product Page

    44067-1201 0440671201

Molex Electronics Ltd.
Part No. 44067-1201 0440671201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating
File Size 204.11K  /  3 Page

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Amphenol Communications Solutions
Part No. 54122-811401800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 40 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    44067-0802 0440670802

Molex Electronics Ltd.
Part No. 44067-0802 0440670802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 10140155-002LF
Description HPCE VT Receptacle 2LP12S
Tech specs 　 　

Official Product Page

    44067-1802 0440671802

Molex Electronics Ltd.
Part No. 44067-1802 0440671802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
File Size 203.99K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-401-03LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 03 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    MOLEX INC
Part No. 0440670403
Description 4 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
File Size 29.79K  /  2 Page

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Amphenol Communications Solutions
Part No. 77311-401-15LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    44067-0603 0440670603

Molex Electronics Ltd.
Part No. 44067-0603 0440670603
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-401-26LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    44067-0401 0440670401

Molex Electronics Ltd.
Part No. 44067-0401 0440670401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
File Size 204.10K  /  3 Page

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Amphenol Communications Solutions
Part No. 10140125-640110LF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x4, 64 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

For 44067-1401 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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