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  45984-8151 Datasheet PDF File

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    SD-45984-400

Molex Electronics Ltd.
Part No. SD-45984-400
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Receptacle Header
File Size 417.45K  /  7 Page

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Amphenol Communications Solutions
Part No. 108-1511-200
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, Guide Module, No Key.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    SD-45984-100

Molex Electronics Ltd.
Part No. SD-45984-100
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Receptacle Header, Right Angle, 10 Power Contacts, 28
File Size 451.78K  /  7 Page

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Amphenol Communications Solutions
Part No. 59112-T38-15-135LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 30 Positions.
Tech specs 　 　

Official Product Page

    MA28151

Dynex Semiconductor
Part No. MA28151
Description RADIATION HARD PROGRAMMABLE COMMUNICATION INTERFACE
File Size 185.89K  /  22 Page

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Amphenol Communications Solutions
Part No. 10127815-14LF
Description Minitek® Pwr 4.2, Dual Row, Receptacle Housing, 14 Positions, Natural Color, GW Compatible Nylon66.
Tech specs 　 　

Official Product Page

    Vitesse Semiconductor C...
Part No. VSC8151
Description 2.488Gb/s SONET/SDH STS-48/STM-16 Section Terminator
File Size 477.06K  /  30 Page

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Amphenol Communications Solutions
Part No. 108-1511-201
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, Guide Module, Ground Contact, No Key.
Tech specs 　 　

Official Product Page

    LA8151V

Sanyo Semicon Device
Part No. LA8151V
Description Downconverter IC
File Size 393.75K  /  7 Page

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Amphenol Communications Solutions
Part No. 77311-815-11LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    W681512

Winbond
Part No. W681512
Description SINGLE-CHANNEL VOICEBAND CODEC
File Size 313.05K  /  38 Page

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Amphenol Communications Solutions
Part No. 10127815-12LF
Description Minitek® Pwr 4.2, Dual Row, Receptacle Housing, 12 Positions, Natural Color, GW Compatible Nylon66.
Tech specs 　 　

Official Product Page

    SANYO[Sanyo Semicon Device]
Part No. LA8151V
Description LA8151V
File Size 386.27K  /  7 Page

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Amphenol Communications Solutions
Part No. 108-1511-101
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, Guide Module, With Post, Ground Contact, No Key.
Tech specs 　 　

Official Product Page

    W681511

Winbond Electronics
WINBOND[Winbond]
Part No. W681511
Description 5V Single-channel Voiceband CODEC w/ Differential output
File Size 401.94K  /  34 Page

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Amphenol Communications Solutions
Part No. 10127815-16LF
Description Minitek® Pwr 4.2, Dual Row, Receptacle Housing, 16 Positions, Natural Color, GW Compatible Nylon66.
Tech specs 　 　

Official Product Page

    W681511

Winbond
Part No. W681511
Description    SINGLE-CHANNEL VOICEBAND CODEC
File Size 408.68K  /  34 Page

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Amphenol Communications Solutions
Part No. 71918-151LF
Description Quickie Eject Latch Shrouded Header, Through Hole, Vertical, Double Row, Polarized, 50 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

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    T88151B

Integrated Technology Future
Part No. T88151B
Description 881.5 MHz SAW Filter
File Size 157.50K  /  2 Page

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Amphenol Communications Solutions
Part No. 108-1511-100
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, Guide Module, With Post, No Key.
Tech specs 　 　

Official Product Page

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