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  73944-5217 Datasheet PDF File

For 73944-5217 Found Datasheets File :: 124+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 |   

    ITT, Corp.
Part No. CPL-5220-16-TNC-79 CPL-5217-30-NNN-79 CPL-5215-06-TNC-79 CPL-5215-10-NNN-79 CPL-5216-10-SMA-79 CPL-5212-30-NNN-71
Description 500 MHz - 2000 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 0.4 dB INSERTION LOSS-MAX
12400 MHz - 18000 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 0.5 dB INSERTION LOSS-MAX
7000 MHz - 12400 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 0.5 dB INSERTION LOSS-MAX
7000 MHz - 18000 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 0.5 dB INSERTION LOSS-MAX
2000 MHz - 4000 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 0.2 dB INSERTION LOSS-MAX

File Size 115.95K  /  2 Page

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Amphenol Communications Solutions

Part No. 73944-2002LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 210 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    DAICO[DAICO Industries, Inc.]
Part No. DSW52179
Description Switch SP5T

File Size 149.66K  /  1 Page

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Amphenol Communications Solutions

Part No. 73944-1003LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Through Hole, 5 Rows, 210 Positions.
Tech specs    

Official Product Page

    NCP5217A

ON Semiconductor
Part No. NCP5217A
Description Single Sync-Rect Step Down Controller

File Size 346.38K  /  16 Page

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Amphenol Communications Solutions

Part No. 73944-1002LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 210 Positions.
Tech specs    

Official Product Page

    LV5217GP

Sanyo Semicon Device
Part No. LV5217GP
Description Bi-CMOS IC For Cell Phones 3ch LED Driver

File Size 103.56K  /  12 Page

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Amphenol Communications Solutions

Part No. 68739-444HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
Part No. MGFC5217 C5217A
Description 18000 MHz - 19000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
From old datasheet system
K-Band 2-Stage Power Amplifier

File Size 40.97K  /  3 Page

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Amphenol Communications Solutions

Part No. 68739-448HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    73944-7116 0739447116

Molex Electronics Ltd.
Part No. 73944-7116 0739447116
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 153.82K  /  4 Page

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Amphenol Communications Solutions

Part No. 68739-446HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    73944-7003 0739447003

Molex Electronics Ltd.
Part No. 73944-7003 0739447003
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 153.83K  /  4 Page

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Amphenol Communications Solutions

Part No. 68739-442HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    73944-7216 0739447216

Molex Electronics Ltd.
Part No. 73944-7216 0739447216
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits

File Size 154.08K  /  4 Page

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Amphenol Communications Solutions

Part No. 68739-440HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    73944-7009 0739447009

Molex Electronics Ltd.
Part No. 73944-7009 0739447009
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 153.83K  /  4 Page

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Amphenol Communications Solutions

Part No. 87052-170HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    73944-7007 0739447007

Molex Electronics Ltd.
Part No. 73944-7007 0739447007
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 153.83K  /  4 Page

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Amphenol Communications Solutions

Part No. 10131935-217ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 17 Positions, 2mm (0.079inch), Vertical.
Tech specs    

Official Product Page

For 73944-5217 Found Datasheets File :: 124+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 |   

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