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  90136-2218 Datasheet PDF File

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    90136-2318

Molex Electronics Ltd.
Part No. 90136-2318
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 254.34K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. TB62218AFTG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs 　 　

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HUA FENG CIRCUIT





    90136-2315

Molex Electronics Ltd.
Part No. 90136-2315
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 15 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 254.34K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. TB62218AFNG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs 　 　

Official Product Page

    90136-2312

Molex Electronics Ltd.
Part No. 90136-2312
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 254.33K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. TB62218FG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs 　 　

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    90136-2122

Molex Electronics Ltd.
Part No. 90136-2122
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 22 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.43K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. TB62218AFG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs 　 　

Official Product Page

    90136-2110

Molex Electronics Ltd.
Part No. 90136-2110
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 10 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.53K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. TB62218FTG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs 　 　

Official Product Page

    90136-2112

Molex Electronics Ltd.
Part No. 90136-2112
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 12 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.43K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. TB62218FNG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs 　 　

Official Product Page

    90136-2115

Molex Electronics Ltd.
Part No. 90136-2115
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 15 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 162.10K  /  4 Page

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Amphenol Communications Solutions
Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    90136-2118

Molex Electronics Ltd.
Part No. 90136-2118
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.43K  /  5 Page

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Amphenol Communications Solutions
Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs 　 　

Official Product Page

    90136-2125

Molex Electronics Ltd.
Part No. 90136-2125
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 25 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.43K  /  5 Page

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Amphenol Communications Solutions
Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    90136-2132

Molex Electronics Ltd.
Part No. 90136-2132
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.43K  /  5 Page

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Amphenol Communications Solutions
Part No. 77313-422-18LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 18 Positions
Tech specs 　 　

Official Product Page

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