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epoxy-encapsulated Datasheet PDF File

For epoxy-encapsulated Found Datasheets File :: 942 Search Time::2.343ms
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				Data Delay Devices, Inc. ETC
Part No.	2211-1500G 2211 2211-1000D 2211-1000G 2211-100A 2211-100B 2211-100D 2211-1200G 2211-120C 2211-150A 2211-150D 2211-2000G 2211-200A 2211-200B 2211-200C 2211-200D 2211-200G 2211-250D 2211-300B 2211-300C 2211-300D 2211-300G 2211-400B 2211-400C 2211-400D 2211SERIES 2211-600C 2211-600D 2211-600G 2211-60A 2211-60B
OCR Text	Epoxy encapsulated Meets or exceeds MIL-D-23859C N/C IN N/C N/C N/C N/C N/C N/C N/C N/C N/C GND 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 N/C OUT N/C N/C N/C N/C N/C N/C N/C N/C N/C N/C data 3 (R) delay devices, inc...
Description	Delay 1000 FIXEDDIPDELAYLINE FIXED DIP DELAY LINE TD/TR = 10
File Size	41.23K / 3 Page	View it Online	Download Datasheet

				HIROSE ELECTRIC Co., Ltd. Electronic Theatre Controls, Inc. Data Delay Devices Inc ETC[ETC] List of Unclassifed Manufacturers
Part No.	2214-1500G 2214 2214-80C 2214-1000D 2214-1000G 2214-100A 2214-100B 2214-100D 2214-1200G 2214-120C 2214-150A 2214-150B 2214-150D 2214-2000G 2214-200A 2214-200B 2214-200C 2214-200D 2214-200G 2214-250D 2214-300B 2214-300C 2214-300D 2214-300G 2214-400B 2214-400C 2214-400D 2214-400G 2214-40C 2214-500C 2214-500D 2214-500G 2214-50A 2214-50B 2214-50D 2214-600C 2214-600D 2214-600G 2214-60A 2214-60B 2214-800C 2214-800D 2214-800G 2214-80A 2214-80B 2214SERIES
OCR Text	...ndwidth (TD/TR =10) Low profile Epoxy encapsulated Meets or exceeds MIL-D-23859C N/C IN T1 T2 T3 T4 T5 T6 T7 T8 T9 GND 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 N/C T20 T19 T18 T17 T16 T15 T14 T13 T12 T11 T10 data 3...
Description	64K Nonvolatile SRAM 20 - TAP在双酯延迟线运输训练班\u003d 10 20-TAP DIP DELAY LINE TD/TR = 10 (SERIES 2214) 20 - TAP在双酯延迟线运输训练班\u003d 10（系214 20-TAP DIP DELAY LINE TD/TR = 10 (SERIES 2214) 20 - TAP在双酯延迟线运输训练班\u003d 10（系2214 20-TAPDIPDELAYLINETD/TR=10(SERIES2214)
File Size	50.80K / 3 Page	View it Online	Download Datasheet

				STMICROELECTRONICS[STMicroelectronics]
Part No.	BAT60J BAT60JFILM BAT60
OCR Text	... 400 Unit C/W () Mounted on epoxy board with recommended pad layout. May 2000 - Ed: 4A 1/5 BAT60J STATIC ELECTRICAL CHARACTERISTICS Symbol VF Tests Conditions Forward voltage drop Tests conditions Tj = 25C IF = 10 mA IF = 10...
Description	SMALL SIGNAL SCHOTTKY DIODE
File Size	57.77K / 5 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC[ETC]
Part No.	MAX1820ZEUB
OCR Text	...pper Solder Plate Silver-filled Epoxy Gold (1.3 mil dia.) Epoxy with silica filler Buildsheet # 05-2301-0048 Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1 IV. Die Information A. Dimens...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	136.36K / 8 Page	View it Online	Download Datasheet

				PANASONIC[Panasonic Semiconductor]
Part No.	AN6096FHN
OCR Text	...rd printed circuit board (Glass epoxy:50 x 50 x t0.8 mm3) Rth(j-a) = 151.5C/W AN6096FHN Power dissipation PD (W) 0.500 0.500 0.300 0.279 0.200 Independent IC without a heat sink Rth(j-a) = 357.4C/W 0.100 0 0 25 50 75 10...
Description	Transmission and reception IC for cellular telephone
File Size	70.15K / 6 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	BLF544B
OCR Text	...lad printed circuit board, with epoxy glass dielectric (r = 2.2), thickness 132 inch. 3. Semi-rigid cables L2 and L27 are soldered on to striplines L1 and L26. 200 handbook, full pagewidth mounting screw rivet strap 85 mounting...
Description	UHF push-pull power MOS transistor
File Size	70.54K / 12 Page	View it Online	Download Datasheet

				Hi-Sincerity Mocroelectroni... Hi-Sincerity Microelectronics HSMC[Hi-Sincerity Mocroelectronics] HSMC CORP.
Part No.	HMBD2003 HMBD2003C HMBD2003S
OCR Text	...solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC...
Description	General purpose diodes fabricated in planar technology
File Size	18.63K / 2 Page	View it Online	Download Datasheet

				FAIRCHILD[Fairchild Semiconductor]
Part No.	MSQC6410C MSQC6440C MSQC6140C MSQC6940C MSQC6110C MSQC6910C
OCR Text	... 15.24 (0.600) * Grey Face * Epoxy Encapsulated PCB * High Performance * High Reliability 38.10 (1.500) 80.00 (0.315) 5.00 (0.197) Applications * Appliances * Automotive * Instrumentation * Process Control MSQCX6XX0W YWW ...
Description	14mm (0.56 inch) Four Digit CLOCK STICK DISPLAY
File Size	334.91K / 7 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	BAS216
OCR Text	...g a small dot of thermo-setting epoxy or UV-curing adhesive centred between the soldering lands (see Fig.10). handbook, halfpage 3.00 handbook, halfpage 3.40 1.25 1.25 1.10 1.00 1.00 MGC119 1.10 MGC126 Dimensions...
Description	High-speed switching diode
File Size	59.08K / 12 Page	View it Online	Download Datasheet

				Electronic Theatre Controls, Inc. ETC[ETC] List of Unclassifed Manufacturers
Part No.	1517 1517-100D 1517-100F 1517-100G 1517-10A 1517-10B 1517-10C 1517-120C 1517-120E 1517-120F 1517-125G 1517-130E 1517-150C 1517-150D 1517-150G 1517-15A 1517-15B 1517-15E 1517-160F 1517-180E 1517-180F 1517-200G 1517-20A 1517-20B 1517-20C 1517-20F 1517-220E 1517-225G 1517-240F 1517-25B 1517-25D 1517-25G 1517-300F 1517-300G 1517-30A 1517-30B 1517-30C 1517-30E 1517-37D 1517-40A 1517-40B 1517-40C 1517-40F 1517-50B 1517-50C 1517-50D 1517-50E 1517-50G 1517-5B 1517-60B 1517-60C 1517-60D 1517-60E 1517-60F 1517-75B 1517-75D 1517-75E 1517-75G 1517-80C 1517-80F 1517-90C 1517-90E
OCR Text	... standard 14-pin dip package epoxy encapsulated meets or exceeds mil-d-23859c functional description the 1517-series device is a fixed, single-input, five-output, passive delay line. the signal input (in) is reproduced at the outputs...
Description	5-TAP DIP DELAY LINE 5，技术咨询双酯延迟线
File Size	36.83K / 2 Page	View it Online	Download Datasheet

For epoxy-encapsulated Found Datasheets File :: 942 Search Time::2.343ms
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