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CYPRESS
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Part No. |
CY7C1440V3
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OCR Text |
...le in 119-ball bump BG,165-ball FBGA package, and 100-pin TQFP packages (CY7C1440V33 and CY7C1442V33). 209 FBGA package for CY7C1446V33. Chip Enable (CE), burst control inputs (ADSC, ADSP, and ADV), write enables (BWa, BWb, BWc, BWd, and BW... |
Description |
1M X 36/2M X 18/512K X 72 Pipelined SRAM
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File Size |
992.68K /
31 Page |
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Samsung Electronic SAMSUNG[Samsung semiconductor] SAMSUNG SEMICONDUCTOR CO. LTD. ITT, Corp.
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Part No. |
K7B161825A K7A163600A K7A163601A K7B163625A K7A161800A K7A161801A K7A203200B-QCI14
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OCR Text |
...2. Correct the Ball Size of 165 FBGA. 1. Delete x32 Org. 2. Delete 165FBGA package. 3. Delelte the 6.5 ns speed bin. Draft Date Feb. 23. 2001 May. 10. 2001 Aug. 30. 2001 Remark Preliminary Preliminary Preliminary
1.0 1.1
May. 10. 2002... |
Description |
512Kx36 & 1Mx18 Synchronous SRAM 64Kx36 & 64Kx32-Bit Synchronous Pipelined Burst SRAM Aluminum Snap-In Capacitor; Capacitance: 390uF; Voltage: 400V; Case Size: 35x30 mm; Packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 470uF; Voltage: 250V; Case Size: 25x30 mm; Packaging: Bulk 512Kx36
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File Size |
264.02K /
19 Page |
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Micron Technology
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Part No. |
MT58L256L36D
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OCR Text |
...ns 100-pin TQFP package 165-pin FBGA package Low capacitive bus loading x18, x32, and x36 versions available
MT58L512L18D, MT58L256L32D, MT58L256L36D
3.3V VDD, 3.3V I/O, Pipelined, DoubleCycle Deselect
100-Pin TQFP*
165-Pin FBGA
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Description |
8Mb: 512K x 18, 256K x 32/36 3.3V I/O, PIPELINED, DCD SYNCBURST SRAM
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File Size |
415.59K /
26 Page |
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Price and Availability
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