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  flip-chip Datasheet PDF File

For flip-chip Found Datasheets File :: 5811    Search Time::2.156ms    
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    Xilinx, Inc.
Part No. XC4013E-2HG240I XC4013E-2HG240M XC4013E-2HG240C XC4013E-3HG240C XC4013E-4HG240I XC4013E-5HG240C XC4013E-3HG240M XC4013E-3HG240I XC4013E-4HG240C XC4013E-4HG240M XC4013E-5HG240I XC4013E-5HG240M XC4013E-1HG240M XC4013E-6HG240C XC4013E-6HG240I XC4013E-6HG240M XC4013E-1HG240C XC4013E-1HG240I
OCR Text ...rades -2 and faster) - Abundant flip-flops - Flexible function generators - Dedicated high-speed carry logic - Wide edge decoders on each ed...chip Select-RAM memory with edge-triggered and dual-port modes, increased speed, abundant routing re...
Description Programmable Gate Arrays 可编程门阵列

File Size 465.61K  /  68 Page

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    Xilinx, Inc.
Part No. XQ2V1000 XQ2V3000 XQ2V6000 XQ2V6000-4BG575M XQ2V1000-4BG575M XQ2V3000-4CG717N XQ2V6000-4CG717N XQ2V6000-4BG728M XQ2V6000-4CG717M XQ2V6000-4FG456N XQ2V6000-4FG456M XILINXINC.-XQ2V1000-4CG717N
OCR Text ...ramic and Plastic Wire-Bond and flip-chip Grid Array Packages IP-Immersion Architecture - Densities from 1M to 6M system gates - 300+ MHz internal clock speed (Advance Data) - 622+ Mb/s I/O (Advance Data) SelectRAMTM Memory Hierarchy - 2.5 ...
Description QPro Virtex-II 1.5V Military QML Platform FPGAs QPro的Virtex - II 1.5V的军事QML第平台FPGA

File Size 2,761.29K  /  127 Page

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    ST Microelectronics
Part No. HDMI05-CL01F3
OCR Text ... hdmi licensing llc. leed-free flip-chip package (8 bumps) 3 2 1 a scl c b hpd sda cec gnd gnd 5v rpu a1 a3 a2 5v scl r3 cec b3 c3 c2 sda gnd hpd b2 c1 gnd r2 r1 www.st.com d r a ft characteristics hdmi05-cl01f3 2/8 doc...
Description 5-line signal conditioning and ESD protection for HDMI interfaces

File Size 254.52K  /  8 Page

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    BAL-2690D3U

STMicroelectronics
Part No. BAL-2690D3U
OCR Text ... footprint: BAL-2690D3U < 1 mm Flip Chip 4 bumps Benefits Very low profile (<700 m) High RF performances RF BOM and area reduction GND Figure 1. Top view Top View Applications Balun transformer for applications such a...
Description EMI Filtering And Signal Conditioning

File Size 294.39K  /  8 Page

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    Xilinx
Part No. 4FG676I
OCR Text ...ble boundary-scan logic support flip-chip and Wire-Bond Ball Grid Array (BGA) packages in three standard fine pitches (0.80mm, 1.00mm, and 1.27mm) 100% factory tested - SelectRAMTM Memory Hierarchy - 3 Mb www.DataSheet4U.com of True Dual...
Description Search --To XC2V1000-4FG676I

File Size 148.56K  /  7 Page

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    MAXIM - Dallas Semiconductor
Part No. DS2411R-105-B5CAT
OCR Text ...low - cost tsoc, sot23 - 3, and flip -chip surface - mount packages ? directly connects to a single - port pin of a microprocessor and communicates at up to 15.4kbps ? overdrive mode boosts communication speed to 125kbps ? o...
Description Silicon Serial Number with VCC Input

File Size 397.73K  /  12 Page

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    ST Microelectronics
Part No. EMIF03-SIM02F2
OCR Text ...netic interferences. The EMIF03 flip chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV. BENEFITS ...
Description 3 LINES EMI FILTER INCLUDING ESD PROTECTION

File Size 102.48K  /  7 Page

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For flip-chip Found Datasheets File :: 5811    Search Time::2.156ms    
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