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For geometry Found Datasheets File :: 3478    Search Time::1.593ms    
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    TDA9109N 5844

STMicroelectronics
Part No. TDA9109N 5844
OCR Text geometry CORRECTIONS VERTICAL PARABOLA GENERATOR (Pincushion, Keystone) HORIZONTAL DYNAMIC PHASE (Side Pin Balance & Parallelogram) HORIZONTAL AND VERTICAL DYNAMIC FOCUS (Horizontal Focus Amplitude, Horizontal Focus Symmetry, Vertical Focus...
Description LOW-COST DEFLECTION PROCESSOR FOR MULTISYNC MONITORS
From old datasheet system

File Size 301.20K  /  32 Page

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    TDA9109SN TDA9109 5969

STMicroelectronics
Part No. TDA9109SN TDA9109 5969
OCR Text geometry CORRECTIONS VERTICAL PARABOLA GENERATOR (Pin Cushion - E/W, Keystone, Corner) HORIZONTAL DYNAMIC PHASE (Side Pin Balance & Parallelogram) VERTICAL DYNAMIC FOCUS (Vertical Focus Amplitude) GENERAL SYNC PROCESSOR 12V SUPPLY VOLTAGE 8...
Description LOW-COST DEFLECTION PROCESSOR FOR MULTISYNC MONITORS
From old datasheet system

File Size 264.31K  /  30 Page

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    TDA9109 TDA9109S 5961

STMicroelectronics
Part No. TDA9109 TDA9109S 5961
OCR Text ... GENERATOR 50 TO 185Hz AGC LOOP geometry TRACKING WITH VPOS & VAMP I2C CONTROLS : VAMP, VPOS, S-CORR, C-CORR DC BREATHING COMPENSATION . I2C geometry CORRECTIONS VERTICAL PARABOLA GENERATOR (Pin Cushion - E/W, Keystone, Corner) HORIZO...
Description LOW-COST DEFLECTION PROCESSOR FOR MULTISYNC MONITORS
From old datasheet system

File Size 293.97K  /  30 Page

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    BAS40-04LT1 ON0119

Motorola, Inc.
ON Semiconductor
Part No. BAS40-04LT1 ON0119
OCR Text ...e package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 inches mm SOT-23 SOT-23 POWER DISSIPATION The power dissipatio...
Description Dual Series Schottky Diode(高速开关应用,-0.50V正向电压,反向电0V的双肖特基势垒二极管)
From old datasheet system
SCHOTTKY BARRIER DIODES

File Size 73.00K  /  4 Page

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    BAS40-06LT1 BAS40-06LT1/D

ON Semiconductor
Part No. BAS40-06LT1 BAS40-06LT1/D
OCR Text ...e package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 inches mm SOT-23 SOT-23 POWER DISSIPATION The power dissipation of the SOT-23...
Description PSoC® Mixed-Signal Array
SCHOTTKY BARRIER DIODE

File Size 74.38K  /  4 Page

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    BAS4004LT1

Motorola, Inc.
Motorola Inc
MOTOROLA[Motorola, Inc]
Part No. BAS4004LT1
OCR Text ...e package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 inches mm SOT-23 SOT-23 POWER DISSIPATION The power dissipatio...
Description CASE 318 08/ STYLE 12 SOT 23 (TO 236AB)
CASE 318 08, STYLE 12 SOT 23 (TO 236AB)

File Size 73.08K  /  4 Page

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    BAS4006LT1

Motorola Inc
MOTOROLA[Motorola, Inc]
Part No. BAS4006LT1
OCR Text ...e package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 inches mm SOT-23 SOT-23 POWER DISSIPATION The power dissipatio...
Description CASE 318-08/ STYLE 11 SOT-23 (TO-236AB)
CASE 318-08, STYLE 11 SOT-23 (TO-236AB)

File Size 74.33K  /  4 Page

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    BAS40LT1 ON0121 BAS4

Motorola Mobility Holdings, Inc.
Motorola Inc
MOTOROLA[Motorola, Inc]
Part No. BAS40LT1 ON0121 BAS4
OCR Text ...e package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 inches mm SOT-23 SOT-23 POWER DISSIPATION The power dissipatio...
Description CASE 318-08, STYLE 8 SOT-23 TO-236AB SILICON, SIGNAL DIODE, TO-236AB
CASE 318-08/ STYLE 8 SOT-23 TO-236AB
From old datasheet system

File Size 71.42K  /  4 Page

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    BCP56T1 BCP56T1SERIES

Motorola Mobility Holdings, Inc.
MOTOROLA[Motorola, Inc]
Part No. BCP56T1 BCP56T1SERIES
OCR Text ...e package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.091 2.3 0.079 2.0 0.059 1.5 0.059 1.5 0.091 2.3 0.248 6.3 0.059 1.5 inches mm SOT-223 SOT-223 POWER DIS...
Description MEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT 中功率NPN硅高当前的晶体管表面贴装

File Size 200.38K  /  6 Page

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    BCP68T1

Motorola Inc
MOTOROLA[Motorola, Inc]
Part No. BCP68T1
OCR Text ...e package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.091 2.3 0.079 2.0 0.059 1.5 0.059 1.5 0.091 2.3 0.248 6.3 0.059 1.5 inches mm SOT-223 SOT-223 POWER DIS...
Description MEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT

File Size 149.51K  /  6 Page

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For geometry Found Datasheets File :: 3478    Search Time::1.593ms    
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