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2V181HJ PE6804 SK85C BAV16W06 06010 CMT164C KD40F40 TSM6866
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    MC100LVEL34 MC100LVEL34DR2 MC100LVEL34DR2G MC100LVEL3406 MC100LVEL34DTR2G MC100LVEL34D MC100LVEL34DG MC100LVEL34DT MC100

ONSEMI[ON Semiconductor]
Part No. MC100LVEL34 MC100LVEL34DR2 MC100LVEL34DR2G MC100LVEL3406 MC100LVEL34DTR2G MC100LVEL34D MC100LVEL34DG MC100LVEL34DT MC100LVEL34DTG MC100LVEL34DTR2
OCR Text ...mV V mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters ar...
Description 3.3V ECL ±2, ±4, ±8 Clock Generation Chip

File Size 141.94K  /  10 Page

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    MPP10-05D12AB MPP10-05S05AB MPP10-05D15AB MPP10-05D05AB MPP10-05S15AB MPP10-12D15AB MPP10-12S05AB MPP10-12D12AB MPP10-12

RSG Electronic Components GmbH
RSG Electronic Components G...
Part No. MPP10-05D12AB MPP10-05S05AB MPP10-05D15AB MPP10-05D05AB MPP10-05S15AB MPP10-12D15AB MPP10-12S05AB MPP10-12D12AB MPP10-12D05AB MPP10-05S3P3AB MPP10-05S12AB MPP10-12S15AB MPP10-12S12AB MPP10-05S24AB
OCR Text ...creepage 8 mm design meet safety standard ansi/aami es60601-1 iec60601-1, en60601-1 case material non-conductive black plastic base material non-conductive black plastic potting material silicon (...
Description REINFORCED INSULATION FOR 250VAC WORKING VOLTAGE

File Size 266.64K  /  4 Page

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    ECJCV50J106M

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Part No. ECJCV50J106M
OCR Text ...erance. vibration proof shall meet the spec ified initial value. for the class 2 capacitors, perform the heat treatment in par. 5.1.1. solder the specimen to the testing jig shown in fig 2. apply a variable vibration of 1.5mm total amplit...
Description PRODUCT SPECIFICATION FOR INFORMATION

File Size 779.32K  /  28 Page

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    MC100LVEL51DR2G MC100LVEL5106 MC100LVEL51MNR4G MC100LVEL51 MC100LVEL51D MC100LVEL51DG MC100LVEL51DR2 MC100LVEL51DT MC100

ONSEMI[ON Semiconductor]
Part No. MC100LVEL51DR2G MC100LVEL5106 MC100LVEL51MNR4G MC100LVEL51 MC100LVEL51D MC100LVEL51DG MC100LVEL51DR2 MC100LVEL51DT MC100LVEL51DTG MC100LVEL51DTR2 MC100LVEL51DTR2G MC100LVEL51MNR4
OCR Text ... 0.5 -600 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters ar...
Description 3.3V ECL Differential Clock D Flip-Flop

File Size 137.73K  /  8 Page

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    MC10EL34DR2G MC10EL3406 MC100EL34DR2G MC10EL34DR2 MC100EL34 MC100EL34D MC100EL34DG MC100EL34DR2 MC10EL34 MC10EL34D MC10E

ONSEMI[ON Semiconductor]
Part No. MC10EL34DR2G MC10EL3406 MC100EL34DR2G MC10EL34DR2 MC100EL34 MC100EL34D MC100EL34DG MC100EL34DR2 MC10EL34 MC10EL34D MC10EL34DG
OCR Text ... V V mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters ar...
Description 5V ECL ±2, ±4, ±8 Clock Generation Chip

File Size 130.00K  /  8 Page

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    MC10ELT20D MC10ELT20DR2 MC10ELT20DR2G MC100ELT20D MC100ELT20DG MC100ELT20DR2 MC100ELT20DR2G MC100ELT20DT MC100ELT20DTG M

ON Semiconductor
Part No. MC10ELT20D MC10ELT20DR2 MC10ELT20DR2G MC100ELT20D MC100ELT20DG MC100ELT20DR2 MC100ELT20DR2G MC100ELT20DT MC100ELT20DTG MC100ELT20DTR2 MC100ELT20DTR2G MC100ELT20MNR4 MC100ELT20MNR4G MC10ELT20DG MC10ELT20DT MC10ELT20DTG MC10ELT20DTR2 MC10ELT20DTR2G MC10ELT20MNR4 MC10ELT20MNR4G MC10ELT20
OCR Text ...t mA mV mV NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters ar...
Description 5VTTL to Differential PECL Translator

File Size 126.70K  /  8 Page

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    NB2669ASNR2G NB2669ASNR2 NB2669A

ONSEMI[ON Semiconductor]
Part No. NB2669ASNR2G NB2669ASNR2 NB2669A
OCR Text ... mA V mS W NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters ar...
Description Low Power, Reduced EMI Clock Synthesizer(低功降低EMI时钟合成

File Size 112.83K  /  8 Page

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    NB2779A NB2779ASNR2 NB2779ASNR2G

ONSEMI[ON Semiconductor]
Part No. NB2779A NB2779ASNR2 NB2779ASNR2G
OCR Text ... mA V mS W NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters ar...
Description Low Power, Reduced EMI Clock Synthesizer

File Size 113.12K  /  8 Page

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    NB2780ASNR2 NB2780ASNR2G NB2780A

ONSEMI[ON Semiconductor]
Part No. NB2780ASNR2 NB2780ASNR2G NB2780A
OCR Text ... mA V mS W NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters ar...
Description Low Power, Reduced EMI Clock Synthesizer

File Size 113.41K  /  8 Page

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    NB2869ASNR2G NB2869ASNR2 NB2869A

ONSEMI[ON Semiconductor]
Part No. NB2869ASNR2G NB2869ASNR2 NB2869A
OCR Text ... mA V mS W NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters ar...
Description Low Power, Reduced EMI Clock Synthesizer(低功降低EMI时钟合成

File Size 113.34K  /  8 Page

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