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CREE[Cree, Inc]
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| Part No. |
CXXXEZ400-SXX000 C450EZ600-SXX000 C460EZ600-SXX000
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| OCR Text |
...e epoxy, solder paste or solder preforms, as well as the flux eutectic method. These vertically structured, low forward voltage LED chips are approximately 100 microns in height. Cree's EZTM chips are tested for conformity to optical and el... |
| Description |
Cree㈢ EZ400⑩ LED
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| File Size |
229.16K /
5 Page |
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it Online |
Download Datasheet
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MACOM[Tyco Electronics]
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| Part No. |
MADA2030G
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| OCR Text |
... die-mounted with AuSn eutectic preforms or with thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. A 80/20 gold/tin preform is recommended with a work surface temperature of ... |
| Description |
5-Bit GaAs Digital Attenuator DC - 2 GHz
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| File Size |
97.83K /
2 Page |
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it Online |
Download Datasheet |
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ON Semi
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| Part No. |
TRA2525 MR3025 ON2996
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| OCR Text |
...int 183C Solder is available as preforms or paste. The paste contains both the metal and flux and can be dispensed rapidly. The solder preform requires the application of a flux to assure good wetting of the solder. The type of flux used de... |
| Description |
ORDERING INFORMATION
From old datasheet system
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| File Size |
121.02K /
8 Page |
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it Online |
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Hittite Microwave Corpo...
HITTITE[Hittite Microwave Corporation]
美国讯泰微波有限公司上海代表
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| Part No. |
HMC361
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| OCR Text |
... die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C and a tool ... |
| Description |
GaAs HBT MMIC DIVIDE-BY-2, DC - 11.0 GHz
From old datasheet system
Prescaler
600,000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
GaAs HBT MMIC DIVIDE-BY-2/ DC - 11.0 GHz
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| File Size |
197.79K /
6 Page |
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it Online |
Download Datasheet |
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Price and Availability
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