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MOTOROLA[Motorola, Inc]
ON Semi
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| Part No. |
MSD601-ST1 MSD601-RT1 ON2380 MSD601RT1
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| OCR Text |
...n order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of t... |
| Description |
NPN General Purpose Amplifier Transistors Surface Mount
From old datasheet system
CASE 318D3, STYLE 1 SC9
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| File Size |
110.82K /
4 Page |
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it Online |
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Panasonic
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| Part No. |
ERJMS4HF6M0U ERJMS4HF5M0U ERJMB1SF4M0U
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| OCR Text |
...ake measures against mechanical stress during and afte r mounting of surface mount resistors (hereafter called the resistors) so as not to damage their electrodes and protecti ve coatings. be careful not to misplace the resistors on the ... |
| Description |
Current Sensing Chip Resistors, Metal Plate Type-MS,MB
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| File Size |
142.73K /
7 Page |
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it Online |
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ON Semi
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| Part No. |
BC847CDW1T1 BC847BDW1T1 ON0164
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| OCR Text |
...n order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of t... |
| Description |
Dual Qeneral Purpose Translstors
From old datasheet system
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| File Size |
172.82K /
8 Page |
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it Online |
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NXP Semiconductors N.V.
ANALOGICTECH[Advanced Analogic Technologies]
PHILIPS[Philips Semiconductors]
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| Part No. |
BGF802-20 BGF802-20_4
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| OCR Text |
...as much as possible. Mechanical stress can occur if the bottom surface of the module and the surface of the amplifier casing (external heatsink) are not mutually flat. This, therefore, should be a consideration when mounting the module in t... |
| Description |
CDMA800 power module
From old datasheet system
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| File Size |
89.84K /
12 Page |
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it Online |
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ON Semi
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| Part No. |
BSS84LT1_D ON0229 ON0228
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| OCR Text |
...n order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of t... |
| Description |
From old datasheet system
P-HANNEL ENHANCEMENT-ODE
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| File Size |
113.31K /
6 Page |
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it Online |
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INTERSIL[Intersil Corporation]
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| Part No. |
FRL430H FRL430R FRL430D FN3234
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| OCR Text |
...ot Traveler HTRB - Hi Temp Gate stress Post Reverse Bias Data and Delta Data HTRB - Hi Temp Drain stress Post Reverse Bias Delta Data F. Group A G. Group B H. Group C I. Group D - Attributes Data Sheet - Attributes Data Sheet - Attributes D... |
| Description |
2A/ 500V/ 2.50 Ohm/ Rad Hard/ N-Channel Power MOSFETs
2A, 500V, 2.50 Ohm, Rad Hard, N-Channel Power MOSFETs
From old datasheet system
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| File Size |
46.72K /
6 Page |
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it Online |
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STANLEY ELECTRIC CO.,LT...
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| Part No. |
VTAN1111C-TR
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| OCR Text |
... soldering condition 1. heat stress during soldering will influence the reliability of leds, however that effect will vary on heating method. also, if components of varying shape are soldered together, it is recommended to set the sold... |
| Description |
Equivalent to JEDEC MSL3
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| File Size |
514.80K /
22 Page |
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it Online |
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Philips
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| Part No. |
PMEG2010EA PMEG2010EA_1
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| OCR Text |
...th an integrated guard ring for stress protection, encapsulated in a SOD323 (SC-76) very small SMD plastic package.
Marking code: E1. The marking bar indicates the cathode.
Fig.1
Simplified outline (SOD323; SC-76) and symbol.
LIMI... |
| Description |
Low VF MEGA Schottky barrier
From old datasheet system
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| File Size |
48.36K /
8 Page |
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it Online |
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