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CREE[Cree, Inc]
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| Part No. |
CRF24060D
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| OCR Text |
... 80/20 AuSn mounted to a 60 mil thick CuMoCu carrier.
Electrical Characteristics (TC = 25C)
(Measured using eutectic die attach with 80/20 AuSn solder mounted to a 60 mil thick CuMoCu carrier)
Characteristics DC Characteristics Gate ... |
| Description |
60 W SiC RF Power MESFET Die
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| File Size |
714.86K /
8 Page |
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it Online |
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VISAY[Vishay Siliconix]
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| Part No. |
CRA08C1002 CRA08C
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| OCR Text |
Thick Film, Resistor Array
FEATURES
* 10 terminal package, 8 bussed resistors, dual common on ends * Automatic placement capability * Flow solderable * Inner electrode protection * Thick film resistance element * Wrap around termination *... |
| Description |
Thick Film, Resistor Array
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| File Size |
33.50K /
2 Page |
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it Online |
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TOSHIBA
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| Part No. |
TPCP8510
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| OCR Text |
... fr4 board (glass epoxy, 1.6 mm thick, cu area: 645 mm 2 ) note 3: using continuously under heavy loads (e.g. t he application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product ... |
| Description |
Power transistor for high-speed switching applications
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| File Size |
207.89K /
5 Page |
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it Online |
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SHARP[Sharp Electrionic Components]
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| Part No. |
GM4BW53340A
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| OCR Text |
Thick Thin Type 1.8 cd White Side View Chip LED
GM4BW53340A Features
n Thin, high luminosity, white type side view chip LED (Blue LED chip + phosphor) n Outline dimensions: 3.85 x 1.0 x 0.5 mm
Outline Dimensions
3.85 (3.6) (1.9) 0.5
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| Description |
0.5 mm Thick Thin Type 1.8 cd White Side View Chip LED
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| File Size |
421.10K /
1 Page |
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it Online |
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BOURNS[Bourns Electronic Solutions]
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| Part No. |
H-92-1 H-90 H-91
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| OCR Text |
...OTH ENDS 2.03 .406 .025 WIDE X THICK (.080) (.016 .001)
15.2 2.54 (0.60 0.10)
H-91*
STAINLESS STEEL BLADE RECESSED .254 (.010) BLADE BLADE
1.47 .457 .025 WIDE X THICK (.058) (.018 .001)
2.29 .457 WIDE X THICK (.090) (.018... |
| Description |
Adjustment Tools
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| File Size |
45.90K /
1 Page |
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it Online |
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC341
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| OCR Text |
...ission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mil... |
| Description |
GaAs MMIC LOW NOISE AMPLIFIER/ 24 - 30 GHz
GaAs MMIC LOW NOISE AMPLIFIER, 24 - 30 GHz
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| File Size |
181.84K /
6 Page |
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it Online |
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC342 -HMC342
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| OCR Text |
...ission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mil... |
| Description |
GaAs MMIC LOW NOISE AMPLIFIER/ 13 - 25 GHz
GaAs MMIC LOW NOISE AMPLIFIER, 13 - 25 GHz
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| File Size |
185.16K /
6 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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