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  0567 Datasheet PDF File

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    0015800145 15-80-0145 70567-0141

Molex Electronics Ltd.
Part No. 0015800145 15-80-0145 70567-0141
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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Amphenol Communications Solutions

Part No. 10130567-101LF
Description AirMax VS2®, Backplane Connectors, 4-Pair, 72 -position, pitch, 6 column, Right Angle.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800165 15-80-0165 70567-0142 A-70567-0142

Molex Electronics Ltd.
Part No. 0015800165 15-80-0165 70567-0142 A-70567-0142
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,

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    15-80-0101 70567-0003 A-70567-0003 0015800101

Molex Electronics Ltd.
Part No. 15-80-0101 70567-0003 A-70567-0003 0015800101
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.41K  /  7 Page

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    15-80-0105 0015800105 A-70567-0139

Molex Electronics Ltd.
Part No. 15-80-0105 0015800105 A-70567-0139
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
Molex Electronics Ltd.

File Size 1,218.43K  /  7 Page

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    15-80-0107 0015800107 A-70567-0207

Molex Electronics Ltd.
Part No. 15-80-0107 0015800107 A-70567-0207
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.53K  /  7 Page

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    15-80-0109 0015800109 70567-0275 A-70567-0275

Molex Electronics Ltd.
Part No. 15-80-0109 0015800109 70567-0275 A-70567-0275
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.

File Size 1,218.56K  /  7 Page

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    15-80-0125 0015800125 70567-0140

Molex Electronics Ltd.
Part No. 15-80-0125 0015800125 70567-0140
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76渭m (30渭") Gold (Au) Selective Pla
Molex Electronics Ltd.

File Size 1,218.47K  /  7 Page

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    15-80-0129 0015800129 A-70567-0276

Molex Electronics Ltd.
Part No. 15-80-0129 0015800129 A-70567-0276
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.

File Size 1,218.57K  /  7 Page

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    70567-0010 A-70567-0010 0015800241

Molex Electronics Ltd.
Part No. 70567-0010 A-70567-0010 0015800241
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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    70567-0011 A-70567-0011 0015800261

Molex Electronics Ltd.
Part No. 70567-0011 A-70567-0011 0015800261
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating

File Size 1,218.43K  /  7 Page

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