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  8215-6003 Datasheet PDF File

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    AN-6003

Fairchild Semiconductor
Part No. AN-6003
Description Shoot-through in Synchronous Buck Converters

File Size 130.24K  /  6 Page

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Amphenol Communications Solutions

Part No. 54122-110082150LF
Description BergStik®, Board to Board connector, Unshrouded Stacking vertical header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MACOM[Tyco Electronics]
Part No. MASY-008215-243000
Description Synthesiser, SMT, 3.15 - 5.55 GHz, 2.5 MHz step.

File Size 288.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 76308-215LF
Description Dubox® 2.54mm, Board to Board Connector, 15 Positions,Single Row,Vertical,2.54mm pitch,Card Connector.
Tech specs    

Official Product Page

    BA8211N BA8215L BA8215

Rohm
Part No. BA8211N BA8215L BA8215
Description Speech Network

File Size 294.60K  /  3 Page

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Amphenol Communications Solutions

Part No. 68482-152HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 52 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TELEDYNE[Teledyne Technologies Incorporated]
Part No. TGM-18-6003
Description Module Amplifier 6 GHz - 18 GHz

File Size 903.14K  /  2 Page

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Amphenol Communications Solutions

Part No. 68482-150HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TELEDYNE[Teledyne Technologies Incorporated]
Part No. TMA-18-6003
Description Amplifier 6 GHz - 18 GHz

File Size 885.39K  /  2 Page

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Amphenol Communications Solutions

Part No. 68458-215HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TELEDYNE[Teledyne Technologies Incorporated]
Part No. TMT-18-6003
Description Temperature Compensated Amplifier 6 GHz - 18 GHz

File Size 885.39K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-111082150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Bel Fuse, Inc.
Part No. USI-6003
Description ASIC 专用集成电路

File Size 1,054.12K  /  20 Page

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Amphenol Communications Solutions

Part No. 78208-215HLF
Description PV Shrouded Header, Wire to Board connector, 2 Wall Shrouded Header - Through Hole - Single row - 15 Positions 2.54mm - Right Angle.
Tech specs    

Official Product Page

    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CPA-18-6003
Description Amplifier 6 GHz - 18 GHz

File Size 885.37K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-111082150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    CGM-18-6003

Teledyne Technologies Incorporated
Part No. CGM-18-6003
Description Module Amplifier 6 GHz - 18 GHz

File Size 903.33K  /  2 Page

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Amphenol Communications Solutions

Part No. 10143578-215KLF
Description Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface Mount, 15 Position,staggered,side Latch<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs    

Official Product Page

    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CPA-13-6003
Description Amplifier 6 GHz - 13 GHz

File Size 885.35K  /  2 Page

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Amphenol Communications Solutions

Part No. 89008-215LF
Description 5 Row Signal Header, Straight, Press-Fit, Wide body
Tech specs    

Official Product Page

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