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  8215-6003 Datasheet PDF File

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    TELEDYNE[Teledyne Technologies Incorporated]
Part No. TMT-18-6003
Description Temperature Compensated Amplifier 6 GHz - 18 GHz

File Size 885.39K  /  2 Page

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Amphenol Communications Solutions

Part No. 76308-215LF
Description Dubox® 2.54mm, Board to Board Connector, 15 Positions,Single Row,Vertical,2.54mm pitch,Card Connector.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Bel Fuse, Inc.
Part No. USI-6003
Description ASIC 专用集成电路

File Size 1,054.12K  /  20 Page

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Amphenol Communications Solutions

Part No. 68482-154HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 54 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CPA-18-6003
Description Amplifier 6 GHz - 18 GHz

File Size 885.37K  /  2 Page

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Amphenol Communications Solutions

Part No. 130-3182-15H
Description Paladin Plus 3-Pair, 8 Column, Right Angle Receptacle, Signal Module, APP
Tech specs    

Official Product Page

    CGM-18-6003

Teledyne Technologies Incorporated
Part No. CGM-18-6003
Description Module Amplifier 6 GHz - 18 GHz

File Size 903.33K  /  2 Page

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Amphenol Communications Solutions

Part No. 130-7282-15H
Description Paladin Plus 7-Pair, 8 Column, Right Angle Receptacle, Signal Module, APP
Tech specs    

Official Product Page

    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CPA-13-6003
Description Amplifier 6 GHz - 13 GHz

File Size 885.35K  /  2 Page

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Amphenol Communications Solutions

Part No. RJE451882151
Description Modular Jack - 8P8C, Vertical, Cat6, THT, No Panel Stops, Single Port, Shield No EMI Tabs, With LEDs
Tech specs    

Official Product Page

    WAP-6003

Level One
Part No. WAP-6003
Description Provides flexibility of 5x 10/100BASE-TX ports Compatible with IEEE 802.11b/g/n wireless standards

File Size 555.11K  /  6 Page

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Amphenol Communications Solutions

Part No. 68482-150HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TELEDYNE[Teledyne Technologies Incorporated]
Part No. TPT-13-6003 TMT-13-6003
Description Temperature Compensated Amplifier 6 GHz - 13 GHz

File Size 885.41K  /  2 Page

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Amphenol Communications Solutions

Part No. 130-5282-15D
Description Paladin Plus 5-Pair, 8 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs    

Official Product Page

    SI-60039

Bel Fuse Inc.
Part No. SI-60039
Description SI-60039

File Size 365.35K  /  5 Page

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Amphenol Communications Solutions

Part No. G85A10082154EU
Description Mini SIM Card Connector, 8 Position, Surface Mount, Push/Push Type, 1.70mm Height, normal open
Tech specs    

Official Product Page

    SI-46003

Bel Fuse Inc.
Part No. SI-46003
Description SI-46003

File Size 314.61K  /  3 Page

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Amphenol Communications Solutions

Part No. 10162688-215202CLF
Description ComboLock®, 1.00mm (0.039in) Signal and 3.00mm (0.118in) Power Crimp-to-Wire Connector Platform, Wire to Board Header, 2P+15S Position., Top Latch, Gold (preplated)
Tech specs    

Official Product Page

    Bel Fuse, Inc.
Part No. SI-60034
Description SI-60034 DATACOM TRANSFORMER FOR GENERAL PURPOSE APPLICATION(S)

File Size 298.52K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-8282-15D
Description Paladin Plus 8-Pair, 8 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs    

Official Product Page

For 8215-6003 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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