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Amphenol Communications Solutions |
| Part No. |
75844-879-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
73933-2034LF
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| Description |
Metral® Board Connectors, Backplane Connectors 5 Row Signal Header, Straight, 5 Mod, Press Fit.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
51700-10303203ACLF
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| Description |
PwrBlade®, Power Supply Connectors, 3P 32S 3P STB Vertical Header.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69173-203HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879144816
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.74K /
48 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
73983-2031LF
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| Description |
Metral® High Speed 1000 Series, Backplane Connectors, Header, Vertical Signal, 5 Row, Press-Fit, 30 Position, Select Load, Standard
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61083-203600LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61083-203609LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2815 0879142815
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
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| File Size |
3,777.37K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
59202-T32-03A085LF
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 6 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10083113-203LF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded vertical header ,Press Fit ,Single row , 3 Positions ,2.54mm (0.100in) Pitch..
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2216 0879142216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114828-13203LF
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| Description |
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 3 Positions
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| Tech specs |
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Official Product Page
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Price and Availability
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