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  88-00158-97 Datasheet PDF File

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    0015800645

Molex Electronics Ltd.
Part No. 0015800645
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat

File Size 1,218.18K  /  7 Page

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Amphenol Communications Solutions

Part No. 87900-158HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Official Product Page

HUA FENG CIRCUIT





    0015800369 15-80-0369

Molex Electronics Ltd.
Part No. 0015800369 15-80-0369
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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    0015800425

Molex Electronics Ltd.
Part No. 0015800425
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    0015800721

Molex Electronics Ltd.
Part No. 0015800721
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, Tin (Sn) Plating

File Size 1,218.25K  /  7 Page

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    0015800265

Molex Electronics Ltd.
Part No. 0015800265
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.30K  /  7 Page

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    15-80-0383 0015800383

Molex Electronics Ltd.
Part No. 15-80-0383 0015800383
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.08K  /  7 Page

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    15-80-0385 0015800385

Molex Electronics Ltd.
Part No. 15-80-0385 0015800385
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    0015800681 15-80-0681

Molex Electronics Ltd.
Part No. 0015800681 15-80-0681
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, Tin (Sn) Plating

File Size 1,218.24K  /  7 Page

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    0015800483

Molex Electronics Ltd.
Part No. 0015800483
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat

File Size 1,218.25K  /  7 Page

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    0015800565

Molex Electronics Ltd.
Part No. 0015800565
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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