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bondpad Datasheet PDF File

For bondpad Found Datasheets File :: 134 Search Time::0.938ms
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				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products]
Part No.	MAX1920 MAX1921EUT MAX1921
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 60 x 41 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Copper/Silicon None .8 microns (as drawn) .8 microns (as drawn) 5 mil...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	88.81K / 8 Page	View it Online	Download Datasheet

				Maxim Integrated Products, Inc. MAXIM[Maxim Integrated Products]
Part No.	MAX6816EUS
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 43 x 30 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 3 microns (as drawn) 3 microns (as drawn) 5 mil. Sq...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	49.42K / 7 Page	View it Online	Download Datasheet

				Maxim Integrated Products, Inc. MAXIM[Maxim Integrated Products] MAXIM - Dallas Semiconductor
Part No.	MAX2530 MAX2531 MAX2531EGI MAX2539 MAX2351 MAX2358 MAX2538
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 89 x 87 mils Si3N4 (Silicon nitride) Au None 1.2 microns (as drawn) Metal 1, 2 & 3 5.6 microns (as drawn) Metal 4 1.6 microns (as drawn) ...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	102.95K / 8 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor Maxim Integrated Products
Part No.	MAX6101EUR
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 44 x 31mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 1.2 microns (as drawn) 1.2 microns (as drawn) 5 mil....
Description	PLASTIC ENCAPSULATED DEVICES
File Size	87.50K / 8 Page	View it Online	Download Datasheet

				Philips Semiconductors NXP Semiconductors
Part No.	PBR941 934043060215
OCR Text	... are shown. 2. Cbpb, Cbpe; base-bondpad and emitter-bondpad capacitance to collector. C cb L2 C Cce MBC964 Fig.12 Package equivalent circuit SOT23. UNIT fF fF fF nH nH nH nH nH 1998 Aug 10 8 Philips Semiconductors...
Description	UHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR UHF wideband transistor
File Size	144.24K / 16 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	PBR951
OCR Text	... are shown. 2. Cbpb, Cbpe; base-bondpad and emitter-bondpad capacitance to collector. C cb L2 C C be Cce MBC964 QLB = 50; QLE = 50; QLB,E(f) = QLB,E(f/fc); fc = scaling frequency = 1 GHz. Fig.12 Package equivalent circu...
Description	UHF wideband transistor
File Size	144.11K / 16 Page	View it Online	Download Datasheet

				Microchip
Part No.	24C02SC 21170C
OCR Text	...lectrically Erasable PROMs with bondpad positions optimized for smart card applications. The devices are organized as a single block of 128 x 8-bit or 256 x 8-bit memory with a two-wire serial interface. The 24C01SC and 24C02SC also have pa...
Description	1K/2K 5.0V I 2 C ? Serial EEPROMs for Smart Cards From old datasheet system
File Size	101.09K / 12 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor Maxim Integrated Products
Part No.	MAX4004EUT
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 60 X 41 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 3 microns (as drawn) 3 microns (as drawn) 5 mil. Sq...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	87.71K / 8 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor Maxim Integrated Products
Part No.	LMX321AXK
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 31 x 30 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Gold None 2 microns (as drawn) 2 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw ...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	88.54K / 9 Page	View it Online	Download Datasheet

				Maxim Integrated Products, Inc. MAXIM[Maxim Integrated Products]
Part No.	MAX4649EKA
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 57 x 43 mils SiN/SiO (nitride/oxide) Aluminum/Si (Si = 1%) None 5 microns (as drawn) 5 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw V....
Description	PLASTIC ENCAPSULATED DEVICES
File Size	58.83K / 8 Page	View it Online	Download Datasheet

For bondpad Found Datasheets File :: 134 Search Time::0.938ms
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