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TC428EPA M68HC LQH44P HE891B LE24L162 1N5943B TC428EPA ZHC1810
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    SGS Thomson Microelectronics
Part No. AN260
OCR Text ...oth time and money. bending and cutting leads the first danger area is bending and cutting the le- ads. in theseprocesses it is important to avoid strai- ning the packageand particularlythearea wherethe leads enter the encapsulating resin. ...
Description HANDLING AND MOUNTING ICS IN PLASTIC POWER PACKAGES

File Size 188.50K  /  7 Page

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    SGS Thomson Microelectronics
Part No. AN533
OCR Text ... even damage it. 1- bending and cutting leads. lead bending must be done carefully. the lead must be firmly held between the plastic package and the bending point during lead operation. if the package / lead interface is strained, the resis...
Description SCR AND TRIAC THERMAL MANAGEMENT - PRECAUTIONS FOR HANDLING AND MOUNTING

File Size 134.87K  /  17 Page

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    STANLEY ELECTRIC CO.,LT...
Part No. FKY3C64X-H
OCR Text ...al is exposed at the tie - bar cutting part. 3. the minimum packing unit is 200 pieces. page : 2 2014.09.22 no. part name materials lead iron pb free dip soldering encapsulant epoxy resin fky3c64x - h specifications pa...
Description    Lead?free soldering compatible

File Size 446.06K  /  20 Page

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    STANLEY ELECTRIC CO.,LT...
Part No. FKY3863X
OCR Text ...al is exposed at the tie - bar cutting part. 3. the minimum packing unit is 200 pieces. page : 2 2014.9.12 no. part name materials lead frame fe + ag plating mold resin epoxy resin fky3863x specifications page : 3 2014...
Description    Lead?free soldering compatible

File Size 375.33K  /  20 Page

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    Panasonic
Part No. AXR51228P
OCR Text ...> a type/b type on board/ board cutting/ board mounting positioning boss 4b type on board not available 8a type <packing> p: embossed tape and paper reel 2 5: i/o connectors for portable equipment <no. of signal wire> 18: sil 18 c...
Description Rectangular Connector

File Size 613.41K  /  16 Page

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