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MACOM[Tyco Electronics]
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| Part No. |
MA4P7441F-1091T
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| OCR Text |
...ding ) Metal Electrode Leadless faced (MELF) package. The device incorporates M/A-COM's proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. The package utilizes M/A-COM's new non- magnetic p... |
| Description |
Non Magnetic SMQ HIPAX PIN Diode
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| File Size |
132.75K /
6 Page |
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it Online |
Download Datasheet
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MACOM[Tyco Electronics]
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| Part No. |
MA4P7461F-1072T
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| OCR Text |
...ding ) Metal Electrode Leadless faced (MELF) package. The device incorporates M/A-COM's proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. The package utilizes M/A-COM's new nonmagnetic pla... |
| Description |
Non Magnetic SMQ HIPAX PIN Diode
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| File Size |
139.81K /
6 Page |
View
it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA4P7464F-1072T
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| OCR Text |
...ding ) Metal Electrode Leadless faced (MELF) package. The device incorporates M/A-COM's proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. The package utilizes M/A-COM's new nonmagnetic pla... |
| Description |
Non Magnetic SMQ HIPAX PIN Diode
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| File Size |
135.46K /
6 Page |
View
it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA4P7470F-1072T
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| OCR Text |
...ding ) Metal Electrode Leadless faced (MELF) package. The device incorporates M/A-COM's proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. The package utilizes M/A-COM's new nonmagnetic pla... |
| Description |
Non Magnetic SMQ HIPAX PIN Diode
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| File Size |
133.39K /
6 Page |
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it Online |
Download Datasheet |
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Microsemi, Corp.
MICROSEMI[Microsemi Corporation]
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| Part No. |
SN1003 SM0502 SM0504 SM0508 SM0509 SM0511 SM0512 SM0812 SM1001 SM1002 SM05.2
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| OCR Text |
faced Bonding Hermetic, Low Loss and Low Distortion Applications High Volume Manufacturing Capability 100% TX Screening Available APPLICATIONS DESCRIPTION
This new line of `MELF' high power PIN diodes are hermetically sealed surface mount ... |
| Description |
CERAMIC MELF PIN DIODES 50 V, SILICON, PIN DIODE
CERAMIC MELF PIN DIODES 500 V, SILICON, PIN DIODE
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| File Size |
173.85K /
2 Page |
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it Online |
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MICROCHIP[Microchip Technology]
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| Part No. |
TC1307
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| OCR Text |
...excellent dynamic response when faced with sudden line and load changes. The voltage detect pin is set for a threshold of 2.63V (typical) and operates down to a minimum input voltage of 1.0V. When the voltage on the detect pin rises above t... |
| Description |
Four-Channel CMOS LDO with Select Mode, Shutdown and Independent Reset
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| File Size |
421.30K /
28 Page |
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it Online |
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MICROSEMI[Microsemi Corporation]
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| Part No. |
UM9608 UM9601 UM9601_06
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| OCR Text |
...cess utilizes symmetrical, full faced metallurgical bonds to both surfaces of the silicon chip. This construction greatly minimizes the normal parasitic inductance and capacitance found in conventional glass or ceramic packaged diodes which... |
| Description |
FOR MICROSTRIP 900 MHz ANTENNNA SWITCHES
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| File Size |
486.16K /
16 Page |
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it Online |
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MICROSEMI[Microsemi Corporation]
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| Part No. |
UM9995
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| OCR Text |
...cess utilizes symmetrical, full faced metallurgical bonds to both surfaces of the silicon chip. This construction greatly minimizes the normal parasite inductance and capacitance found in conventional glass or ceramic packaged diodes, which... |
| Description |
ULTRA LOW MAGNETIC MRI SWITCHING DIODES
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| File Size |
244.49K /
3 Page |
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it Online |
Download Datasheet |
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Price and Availability
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