particles pdf Datasheet P4 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : SVC70409 150B1 WR11BSN LM290 DMC16 1N100 C3320 MCJ10A
	Product Description
	Full Text Search

particles Datasheet PDF File

For particles Found Datasheets File :: 782 Search Time::2.141ms
Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				Dynex Semiconductor Ltd. DYNEX[Dynex Semiconductor]
Part No.	MP03XX280 MP03XX280-20 MP03XX280-14 MP03XX280-16 MP03XX280-18
OCR Text	...d be taken to ensure no foreign particles remain. An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum ther...
Description	Dual Diode Modules
File Size	94.69K / 9 Page	View it Online	Download Datasheet

				Dynex Semiconductor, Ltd. DYNEX[Dynex Semiconductor]
Part No.	MP03XX440 MP03XX440-21 MP03XX440-16 MP03XX440-18 MP03XX440-20
OCR Text	...d be taken to ensure no foreign particles remain. An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum ther...
Description	Dual Diode Modules 双二极管模块
File Size	101.08K / 10 Page	View it Online	Download Datasheet

				Dynex Semiconductor Ltd. DYNEX[Dynex Semiconductor]
Part No.	MP03XXX130 MP03_130-16 MP03_130-18 MP03_130-20 MP03/130-16 MP03/130-18 MP03/130-20 MP03HBT130-20
OCR Text	...d be taken to ensure no foreign particles remain. An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum ther...
Description	210 A, 2000 V, SCR MB 31C 31#16 SKT RECP MB 31C 31#16 PIN RECP MB 19C 19#12 SKT RECP Phase Control Dual SCR, SCR/Diode Modules
File Size	111.83K / 10 Page	View it Online	Download Datasheet

				DYNEX[Dynex Semiconductor] Dynex Semiconductor Ltd.
Part No.	MP03XXX175 MP03_175-10 MP03_175-12 MP03_175-14 MP03_175-16 MP03/175-12 MP03/175-10 MP03/175-14 MP03/175-16
OCR Text	...d be taken to ensure no foreign particles remain. An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum ther...
Description	Phase Control Dual SCR, SCR/Diode Modules MB 61C 61#20 PIN RECP MB 31C 31#16 SKT RECP
File Size	112.76K / 10 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	UBA1710M
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; f...
Description	Modulator for GaAs power amplifiers
File Size	58.92K / 12 Page	View it Online	Download Datasheet

				Littelfuse, Inc. LITTELFUSE[Littelfuse]
Part No.	V302AS32 V302AS42 V402AS32 V402AS42 V402AS60 V602AS32 AS V502AS32 V502AS42 LITTELFUSEINC.-V602AS32
OCR Text	...m ELECTRODE OF SPRAYED ALUMINUM particles FACE CAMBER = 0.15mm MAX D ELECTRODE = 0.10mm TYPICAL H PARAMETER Diameter (D) Min Max Height (H) Min Max Ordering Information OBSOLETE PART DIMENSIONS (IN MILLIMETERS) PART NUMBER V...
Description	High Energy Metal-Oxide Arrester Blocks 高能金属氧化物避雷器
File Size	85.34K / 4 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	HTRC12002B
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for ...
Description	HITAG co-processor
File Size	54.43K / 8 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	74HCT109 74HC109 74HC109PW 74HC109D 74HC109DB 74HC109N 74HCT109D 74HCT109DB 74HCT109N 74HCT109PW 74HC 74HC109NB 74HCT109NB
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; f...
Description	Dual JK flip-flop with set and reset; positive-edge trigger Dual JK flip-flop with set and reset positive-edge trigger
File Size	65.58K / 9 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRPT1061A
OCR Text	...61A power module. 2. Remove all particles and grit from the heat sink and power substrate. 3. Spread a .004" to .005" layer of silicone grease on the heat sink, covering the entire area that the power substrate will occupy. Recommended heat...
Description	Power Module for 1 hp Motor Drives
File Size	234.28K / 12 Page	View it Online	Download Datasheet

				Dynex Semiconductor, Ltd. Dynex Semiconductor Ltd.
Part No.	MP03HBT360-08 MP03HBT360-10 MP03HBT360-12 MP03HBT360-14 MP03HBT360-16 MP03HBT360-18 MP03HBN360-18 MP03HBP360-18 MP03HBN360-16 MP03HBN360-14 MP03HBP360-08 MP03HBP360-10
OCR Text	...d be taken to ensure no foreign particles remain. POWER ASSEMBLY CAPABILITY The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD design tools the group has developed...
Description	Dual Thyristor, Thyristor/Diode Module 553 A, 1000 V, SCR Dual Thyristor, Thyristor/Diode Module 553 A, 800 V, SCR Dual Thyristor, Thyristor/Diode Module 560 A, 1400 V, SCR
File Size	261.78K / 9 Page	View it Online	Download Datasheet

For particles Found Datasheets File :: 782 Search Time::2.141ms
Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |