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unbumped Datasheet PDF File

For unbumped Found Datasheets File :: 33 Search Time::2.046ms
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					PROTEK DEVICES
Part No.	ULC0404FC12C-T75-1 ULC0404FC24C-T75-1 ULC0404FC05C-LF-T75-1 ULC0404FC05C-LF-T710-2
OCR Text	unbumped low capacitance flip chip array ulc0404fc3.3c thru ulc0404fc36c 05168 applications ? cellular phones ? personal digital assistant (pda) ? notebook computers ? smart cards iec compatibility (en61000-4) ? 61000-4-2 (esd): air -...
Description	200 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE
File Size	72.29K / 6 Page	View it Online	Download Datasheet

					NXP
Part No.	SL2ICS2001V1D
OCR Text	...tio 1 62 x 62 m 2 ? pad size (unbumped): ? la, lb 78 x 78 m 2 ? vss 1 , testio 1 48 x 48 m 2 ? bump size variation: 5 m ? under bump metallization: sputtered tiw 3.6 fail die identification every die is electrically tested accord...
Description	I-CODE SLI Label IC bumped wafer specification on UV-tape
File Size	198.40K / 9 Page	View it Online	Download Datasheet

					Protek Devices
Part No.	ULC0402FC05C ULC0402FC08C
OCR Text	unbumped low capacitance flip chip arra y only one name means protektion? applica tions ? cellular phones ? personal digital assistant (pda) ? notebook computers ? smart cards iec compa tibility (en61000-4) ? 61000-4-2 (esd): air - 1...
Description	5.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards 8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
File Size	159.87K / 4 Page	View it Online	Download Datasheet

For unbumped Found Datasheets File :: 33 Search Time::2.046ms
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