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NXP
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Part No. |
SL2ICS2001V1D
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OCR Text |
...tio 1 62 x 62 m 2 ? pad size (unbumped): ? la, lb 78 x 78 m 2 ? vss 1 , testio 1 48 x 48 m 2 ? bump size variation: 5 m ? under bump metallization: sputtered tiw 3.6 fail die identification every die is electrically tested accord... |
Description |
I-CODE SLI Label IC bumped wafer specification on UV-tape
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File Size |
198.40K /
9 Page |
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it Online |
Download Datasheet |
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unbumped Found Datasheets File :: 33 Search Time::2.046ms Page :: | 1 | 2 | 3 | <4> | |
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