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  106a Datasheet PDF File

For 106a Found Datasheets File :: 255    Search Time::1.64ms    
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    EMIF6-100LFC07 EMIF6-100LFC

PROTEC[Protek Devices]
Part No. EMIF6-100LFC07 EMIF6-100LFC
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description EMI FILTER/TVS ARRAY

File Size 87.74K  /  5 Page

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    EMIF6-100LFC EMIF6100LFC

PROTEC[Protek Devices]
Part No. EMIF6-100LFC EMIF6100LFC
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description EMI FILTER/TVS ARRAY

File Size 112.76K  /  5 Page

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    ESD4-LFC07 ESD4-LFC

PROTEC[Protek Devices]
Part No. ESD4-LFC07 ESD4-LFC
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description LOW CAPACITANCE FLIP CHIP ARRAY

File Size 60.65K  /  4 Page

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    ESD4-LFC

Protek Devices
Part No. ESD4-LFC
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description LOW CAPACITANCE FLIP CHIP ARRAY

File Size 90.12K  /  4 Page

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    P0408FC3.3C P0408FC12C P0408FC08C P0408FC05C P0408FC36C P0408FC15C P0408FC24C P0408FC33C

PROTEC[Protek Devices]
Part No. P0408FC3.3C P0408FC12C P0408FC08C P0408FC05C P0408FC36C P0408FC15C P0408FC24C P0408FC33C
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description DEVICE CHARACTERISTICS

File Size 117.23K  /  6 Page

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    PKFC3.3C PKFC36C PKFC05C PKFC08C PKFC12C PKFC15C PKFC24C PKFC33C

PROTEC[Protek Devices]
Part No. PKFC3.3C PKFC36C PKFC05C PKFC08C PKFC12C PKFC15C PKFC24C PKFC33C
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description PACKAGED FLIP CHIP ARRAY

File Size 76.68K  /  5 Page

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    SFC05-4-T75-1 SFC05-4-T75-2 SFC05-4_07 SFC05-4 SFC05-4-LF-T75-2 SFC05-407

PROTEC[Protek Devices]
Part No. SFC05-4-T75-1 SFC05-4-T75-2 SFC05-4_07 SFC05-4 SFC05-4-LF-T75-2 SFC05-407
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description    FLIP CHIP ARRAY

File Size 85.31K  /  6 Page

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    ULLC0402FC05C-T710-2 ULLC0402FC05C-T75-1 ULLC0402FC05C06 ULLC0402FC05C

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PROTEC[Protek Devices]
Part No. ULLC0402FC05C-T710-2 ULLC0402FC05C-T75-1 ULLC0402FC05C06 ULLC0402FC05C
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

File Size 72.18K  /  5 Page

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    PKFC05C PKFC12C PKFC08C PKFC3.3C PKFC36C PKFC15C PKFC24C

List of Unclassifed Manufacturers
N.A.
ETC[ETC]
Part No. PKFC05C PKFC12C PKFC08C PKFC3.3C PKFC36C PKFC15C PKFC24C
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description PACKAGED FLIP CHIP ARRAY

File Size 94.70K  /  5 Page

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    CSPPT08 CSPPT16 CSPPT16-101F CSPPT16-101J CSPPT16-470F CSPPT16-470J CSPPT16-500F CSPPT16-500J CSPPT16-560F CSPPT16-560J

California Micro Devices Co...
CALMIRCO[California Micro Devices Corp]
California Micro Devices Corporation
California Micro Device...
Part No. CSPPT08 CSPPT16 CSPPT16-101F CSPPT16-101J CSPPT16-470F CSPPT16-470J CSPPT16-500F CSPPT16-500J CSPPT16-560F CSPPT16-560J CSPPT16-680F CSPPT16-680J CSPPT16-900F CSPPT16-900J CSPPT08-560F CSPPT32-560F CSPPT08-101F CSPPT08-101J CSPPT08-470F CSPPT08-470J CSPPT08-500J CSPPT08-680F CSPPT08-680J CSPPT08-900F CSPPT32-900J CSPPT CSPPT08-500F CSPPT08-560J CSPPT08-900J CSPPT32 CSPPT32-101F CSPPT32-101J CSPPT32-470F CSPPT32-470J CSPPT32-500F CSPPT32-500J CSPPT32-560J CSPPT32-680F CSPPT32-680J CSPPT32-900F
OCR Text .../50 No Clean OSP (Entek Cu Plus 106a) Typical Solder Reflow Thermal Profile (No Clean Flux) 250 EXH 225 200 PH Z2 Z3 Z4 Z5 RF CD EXH Temperature (oC) 175 150 125 100 75 50 25 0 48 97 145 194 Time (s) 242 290 339 387 435 PART NU...
Description CHIP SCALE PARALLEL TERMINATION ARRAY 终止芯片大规模并行阵

File Size 57.04K  /  4 Page

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For 106a Found Datasheets File :: 255    Search Time::1.64ms    
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