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Amphenol Communications Solutions |
Part No. |
20121C00BD
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Description |
Elite Backplane connectors, BMA 12pair, 8position, NiS
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10153301-20121LF
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Description |
PC104, Board to Board Connectors, 2.54mm Pitch, 2x20P, DIP=12.2, Through Hole, 10u\\ Gold Plated, solder tail 3u\\ Gold
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10131319-2012100LF
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Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 20 Positions, Non GW Compatible Nylon66, Tray Packing.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10131319-20121G0LF
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Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 20 Positions, GW Compatible Nylon66, Tray Packing.
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Tech specs |
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Official Product Page
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Bourns, Inc. BOURNS INC
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Part No. |
CW201212-R33J CW201212-12NJ CW201212-R56J CW201212-R91J CW201212-3N3J BOURNSINC-CW201212-R82J CW201212-10NJ CW201212-82NJ
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Description |
MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.56 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.91 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.0033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Inductor; Inductor Type:High Frequency; Inductance:13.3nH; Inductance Tolerance: /- 5 %; Current Rating:600mA; Series:CW201212; Package/Case:0805; Core Material:Alumina Ceramic; Leaded Process Compatible:Yes RoHS Compliant: Yes
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File Size |
73.20K /
1 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
G87MP201215P1HR
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Description |
MINI POWER PLUS board mount connector
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L17H2220121
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Description |
Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (.750in), 9/9 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Removable Front Screwlock, 2*Arrowhead Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L17H1220121
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Description |
Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=15.88mm (0.625in), 9/9 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Removable Front Screwlock, 2*Arrowhead Boardlock
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Tech specs |
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Official Product Page
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Bourns Inc. Bourns, Inc.
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Part No. |
CI201210-6N8J CI201210-5N6D CI201210-4N7D CI201210-8N2J CI201210-2N2D CI201210-2N7D CI201210-R33J CI201210-R39J CI201210-47NJ CI201210-R47J CI201210-33NJ CI201210-1N8D CI201210-1N0D CI201210-R27J CI201210-R12J CI201210-68NJ CI201210-1N5D CI201210-R18J CI201210-18NJ CI201210-10NJ
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Description |
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
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File Size |
433.40K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10127720-121RLF
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Description |
Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 12 Positions, 100u\\ Tin plating, Non GW Compatible LCP, With Pegs, Tape and Reel.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10131319-201210PLF
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Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 20 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
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Tech specs |
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Official Product Page
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Bourns Inc. Bourns, Inc.
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Part No. |
CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210-R47J CE201210-8N2J CE201210-2N7D CE201210-2N2D CE201210-R33J CE201210-R39J CE201210-47NJ CE201210-15NJ CE201210-18NJ CE201210-12NJ CE201210-10NJ CE201210-R10J CE201210-68NJ CE201210-33NJ CE201210-1N8D CE201210-82NJ CE201210-39NJ CE201210-27NJ CE201210-R27J CE201210-R12J
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Description |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52 8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20 IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感 Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
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File Size |
200.78K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
G87MP201212C1HR
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Description |
MINI POWER PLUS board mount connector
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Tech specs |
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Official Product Page
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Part: 2012 |
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