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Amphenol Communications Solutions |
| Part No. |
10137785-052141LF
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| Description |
Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Gold Flash plating, Natural Color, 5 Positions, Non GW Compatible, with Post, Tray packing.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54121-410041600LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54121-419041650LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
91910-21415LF
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| Description |
Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Header, Surface Mount, 15 Positions, 1.00mm ( 0.039in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
91900-21411LF
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| Description |
Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Conan Vertical Header, Surface Mount, 11 Positions, 1.00mm (0.039in) Pitch
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Official Product Page
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Intersil
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| Part No. |
EL2140 EL2141
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| Description |
150MHz, Differential Twisted-Pair Driver, Fixed Gain Amplifier
150MHz, Differential Twisted-Pair Driver, User-Defineable Gain Amplifier
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| File Size |
162.62K /
8 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
61082-141402LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
79821-412HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 12 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54121-416063050LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-3214-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-8214-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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Official Product Page
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Bom2Buy.com
Price and Availability
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