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Amphenol Communications Solutions |
Part No. |
10114831-10114LF
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Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
70553-0021 0705530021
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Description |
2.54mm (.100) Pitch SL?/a> Header, Low Profile, Single Row, Right Angle, .120 PocketShrouded, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail 2.54mm (.100) Pitch SL Header, Low Profile, Single Row, Right Angle, .120 PocketShrouded, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail
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File Size |
348.19K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10114828-10114LF
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Description |
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114829-10114LF
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Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
70553-0022 0705530022
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Description |
2.54mm (.100) Pitch SL?/a> Header, Low Profile, Single Row, Right Angle, .120 PocketShrouded, 23 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail 2.54mm (.100) Pitch SL Header, Low Profile, Single Row, Right Angle, .120 PocketShrouded, 23 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail
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File Size |
348.19K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10114830-10114LF
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Description |
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
70553-0023 0705530023
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Description |
2.54mm (.100) Pitch SL?/a> Header, Low Profile, Single Row, Right Angle, .120 Pocket,Shrouded, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail 2.54mm (.100) Pitch SL Header, Low Profile, Single Row, Right Angle, .120 Pocket,Shrouded, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail
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File Size |
348.19K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10114508-D0J-20DLF
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Description |
XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114828-10102LF
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Description |
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114868-L0J-10DLF
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Description |
XCede® High Speed Backplane Connectors, 3 wall left header.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114508-00J-20DLF
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Description |
XCede® High Speed Backplane Connectors, 2 wall header.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114492-008LF
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Description |
HPCE R/A REC 32P24S
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114868-10J-10DLF
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Description |
XCede® High Speed Backplane Connectors, 4 wall header.
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Tech specs |
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Official Product Page
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Bom2Buy.com

Price and Availability
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