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Amphenol Communications Solutions |
| Part No. |
95278-402-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G888002061THR
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| Description |
Board mount - Header Receptacle - Wire to Board 2.54mm Pitch Right Angle DIP,1x2Pin,Matte Tin,NY4T,Color-Black,Tray
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68020-606H
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0012 0717640012
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, Tin (Sn) Plating
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| File Size |
121.14K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
57102-G02-06LF
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| Description |
Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 12 Positions
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0717640112 71764-0112
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
MOLEX Connector
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| File Size |
121.09K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-802-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 06 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0010 0717640010
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 10 Circuits, Tin (Sn) Plating
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| File Size |
121.14K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10078993-G02-06ULF
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| Description |
Minitek®, Wire to Board Connectors, Shrouded Header with Low Profile Eject Latch - Through Mount Pin-in-Paste - Double row - 6 Positions - 2mm (0.079inch) - Vertical
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0014 0717640014
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 14 Circuits, Tin (Sn) Plating
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| File Size |
121.06K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
75844-302-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0016 0717640016
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, Tin (Sn) Plating
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| File Size |
121.06K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
93689-102-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Press Fit, Single row , 6 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0028 0717640028
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, Tin (Sn) Plating
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| File Size |
120.83K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
95293-402-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,6 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0030 0717640030
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right An
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| File Size |
120.99K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68020-616
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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