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  73944-5217 Datasheet PDF File

For 73944-5217 Found Datasheets File :: 124+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 |   

    0739441017

Molex Electronics Ltd.
Part No. 0739441017
Description 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 73944-2002LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 210 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0739441005

Molex Electronics Ltd.
Part No. 0739441005
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option

File Size 153.82K  /  4 Page

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Amphenol Communications Solutions

Part No. 73944-1003LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Through Hole, 5 Rows, 210 Positions.
Tech specs    

Official Product Page

    0739441009

Molex Electronics Ltd.
Part No. 0739441009
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 153.82K  /  4 Page

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Amphenol Communications Solutions

Part No. 73944-1002LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 210 Positions.
Tech specs    

Official Product Page

    73944-1000 0739441000

Molex Electronics Ltd.
Part No. 73944-1000 0739441000
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 68739-444HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    73944-1001 0739441001

Molex Electronics Ltd.
Part No. 73944-1001 0739441001
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 68739-448HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    73944-1003 0739441003

Molex Electronics Ltd.
Part No. 73944-1003 0739441003
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderGuide Pin Option, 144 Circuits

File Size 153.82K  /  4 Page

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Amphenol Communications Solutions

Part No. 68739-446HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    73944-1201 0739441201

Molex Electronics Ltd.
Part No. 73944-1201 0739441201
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 68739-442HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    73944-1200 0739441200

Molex Electronics Ltd.
Part No. 73944-1200 0739441200
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 68739-440HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0739441216

Molex Electronics Ltd.
Part No. 0739441216
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 87052-170HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    0739441016

Molex Electronics Ltd.
Part No. 0739441016
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 10131935-217ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 17 Positions, 2mm (0.079inch), Vertical.
Tech specs    

Official Product Page

For 73944-5217 Found Datasheets File :: 124+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 |   

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