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  87832-1816 Datasheet PDF File

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    87832-5423

Molex Electronics Ltd.
Part No. 87832-5423
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 10 Circuits, 0.76μm (30μ) Gold (Au) Plating, Pick-and-Place Cap, with Locking
File Size 386.58K  /  6 Page

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Rochester Electronics LLC
Part No. CYD18S18V18-167BBAXI
Description CYD18S18 - Fullflex Synchronous Sdr Dual Port SRAM, Industrial Temp
Tech specs 　 　

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HUA FENG CIRCUIT





    87832-3620

Molex Electronics Ltd.
Part No. 87832-3620
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 36 Circuits, 0.38μm (15μ) Gold (Au) Plating
File Size 367.53K  /  6 Page

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Rochester Electronics LLC
Part No. CYD18S36V18-167BBAI
Description 512KX36 DUAL-PORT SRAM, 4ns, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, MO-192, FBGA-256
Tech specs 　 　

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    87832-3621

Molex Electronics Ltd.
Part No. 87832-3621
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 36 Circuits, 0.76μm (30μ) Gold (Au) Plating
File Size 386.26K  /  6 Page

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Rochester Electronics LLC
Part No. CYD18S18V18-167BBAXC
Description CYD18S18 - Fullflex Synchronous Sdr Dual Port SRAM, Commercial Temp
Tech specs 　 　

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    87832-3622

Molex Electronics Ltd.
Part No. 87832-3622
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Lead free, 36 Circuits, 0.38μm (15μ) Gold (Au) Plating, Pick-and-Place Cap
File Size 367.55K  /  6 Page

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Amphenol Communications Solutions
Part No. 77315-118-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs 　 　

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    87832-5223

Molex Electronics Ltd.
Part No. 87832-5223
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 6 Circuits, 0.76μm (30μ) Gold (Au) Plating, Pick-and-Place Cap
File Size 386.48K  /  6 Page

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Amphenol Communications Solutions
Part No. 54121-816142500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    87832-5222

Molex Electronics Ltd.
Part No. 87832-5222
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 6 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Pick-and-Place Cap
File Size 367.87K  /  6 Page

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Amphenol Communications Solutions
Part No. 10118169-001LF
Description HPCE STMT REC 16P16S
Tech specs 　 　

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    87832-4023

Molex Electronics Ltd.
Part No. 87832-4023
Description
File Size 386.23K  /  6 Page

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Amphenol Communications Solutions
Part No. 71918-160
Description Quickie Eject Latch Shrouded Header, Through Hole, Vertical, Double Row, 60 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

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    87832-7122

Molex Electronics Ltd.
Part No. 87832-7122
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 44 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Pick-and-Place Cap
File Size 367.67K  /  6 Page

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Amphenol Communications Solutions
Part No. SE1816023111111
Description Slim Cool Edge 0.65mm, Surface mount, 8 power pins, 160 signal pins, Vertical
Tech specs 　 　

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    87832-4021

Molex Electronics Ltd.
Part No. 87832-4021
Description
File Size 386.31K  /  6 Page

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Amphenol Communications Solutions
Part No. 77313-818-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 16 Positions
Tech specs 　 　

Official Product Page

    87832-4020

Molex Electronics Ltd.
Part No. 87832-4020
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 40 Circuits, 0.38μm (15μ) Gold (Au) Plating
File Size 367.54K  /  6 Page

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Amphenol Communications Solutions
Part No. 89891-816HLF
Description REC VER THT 32pos
Tech specs 　 　

Official Product Page

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