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  90147-1118 Datasheet PDF File

For 90147-1118 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    1118-4798 11-18-4798

Molex Electronics Ltd.
Part No. 1118-4798 11-18-4798
Description Combination Anvil

File Size 11.48K  /  1 Page

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Amphenol Communications Solutions

Part No. 87901-470HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    1118-4799 11-18-4799

Molex Electronics Ltd.
Part No. 1118-4799 11-18-4799
Description Insulation Punch

File Size 11.48K  /  1 Page

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Amphenol Communications Solutions

Part No. 87901-472HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 72 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    SPA-1118 SPA-1118Z

SIRENZA MICRODEVICES
Part No. SPA-1118 SPA-1118Z
Description 850 MHz 1 Watt Power Amplifier with Active Bias

File Size 105.73K  /  5 Page

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Amphenol Communications Solutions

Part No. U77A11181001
Description SFP CAGE 1X1 TIN TRAY
Tech specs    

Official Product Page

    71973-1118

Molex Electronics Ltd.
Part No. 71973-1118
Description 2.54mm (.100) Pitch C-Grid? PCB Connector, Dual Row, Right Angle, Early EntryReceptacle, with Flange, 36 Circuits

File Size 4,623.88K  /  28 Page

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Amphenol Communications Solutions

Part No. U77C11181011
Description BRIGHT TIN PLT/R EMI PIN
Tech specs    

Official Product Page

    1118-5061 0011-18-5061

Molex Electronics Ltd.
Part No. 1118-5061 0011-18-5061
Description Conductor Punch

File Size 14.41K  /  1 Page

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Amphenol Communications Solutions

Part No. 68491-118HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51118-1605

Molex Electronics Ltd.
Part No. 51118-1605
Description 4.00mm (.158) Wire-to-Wire Retainer, 16 circuits

File Size 67.27K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-118-09LF
Description BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions
Tech specs    

Official Product Page

    1118-50 0011-18-5000

Molex Electronics Ltd.
Part No. 1118-50 0011-18-5000
Description Conductor Punch

File Size 14.41K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-118-19LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1118-5044 11-18-5044 0011-18-5044

Molex Electronics Ltd.
Part No. 1118-5044 11-18-5044 0011-18-5044
Description Combination Anvil

File Size 11.60K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-118-29LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    11-18-5069 0011-18-5069 1118-5069

Molex Electronics Ltd.
Part No. 11-18-5069 0011-18-5069 1118-5069
Description Conductor Punch

File Size 14.41K  /  1 Page

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Amphenol Communications Solutions

Part No. 54111-118021450LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1118-5062 0011-18-5062

Molex Electronics Ltd.
Part No. 1118-5062 0011-18-5062
Description Insulation Punch

File Size 14.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 54111-802030850LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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