bondpad pdf Datasheet P5 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : CJ5554 L4728 CO55B IRF3315L 150103 DS125 CY2077SI AE465PYA
	Product Description
	Full Text Search

bondpad Datasheet PDF File

For bondpad Found Datasheets File :: 130 Search Time::1.11ms
Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |

				List of Unclassifed Manufacturers ETC[ETC]
Part No.	MAX8538 MAX8538EEI MAX8539 MAX8537
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 140 x 80 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 0.8 microns (as drawn) 0.8 microns (as drawn) 5 mi...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	95.30K / 8 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products]
Part No.	MAX5028 MAX5027 MAX5026EUT MAX5025 MAX5026
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 60 X 41 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 3 microns (as drawn) 3 microns (as drawn) 5 mil. Sq...
Description	500kHz 36V Output SOT23 PWM Step-Up DC-DC Converters RELIABILITY REPORT FOR MAX5026EUT PLASTIC ENCAPSULATED DEVICES
File Size	88.71K / 8 Page	View it Online	Download Datasheet

				Maxim Integrated Products
Part No.	MAX3950EGK
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 115 x 99 mils Si3N4 (Silicon nitride) Au None Metal1: 1.2; Metal2: 1.2; Metal3: 1.2; Metal4: 5.6 microns (as drawn) Metal1: 1.6; Metal2: ...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	160.91K / 7 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products]
Part No.	MAX3801UGG
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 81 x 68 mils Si3N4 (Silicon nitride) Poly / Au None Metal1: 1.2; Metal2: 1.2; Metal3: 2.8; Metal4: 5.6 microns (as drawn) Metal1: 1.3; Me...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	65.71K / 7 Page	View it Online	Download Datasheet

				Maxim Integrated Products
Part No.	MAX1973EUB
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 62 X 89 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) TiW/ AlCu/ TiWN None .8 microns (as drawn) .8 microns (as drawn) 5 mil. Sq. Si...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	44.91K / 8 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC
Part No.	MAX3863EGJ
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 81 x 81 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Poly / Au None Metal1: 1.2; Metal2: 1.2; Metal3: 1.2; Metal4: 5.6 microns (as ...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	62.40K / 7 Page	View it Online	Download Datasheet

				Maxim Integrated Products
Part No.	MAX6656MEE
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 86 x 144 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Copper/Si None .8 microns (as drawn) .8 microns (as drawn) 5 mil. Sq...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	114.68K / 8 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	HT2MOA3S20
OCR Text	...verall Thickness Film Thickness bondpad Size for Transponder Coil / Module Interconnection 0.45 mm 0.03 mm 0.16 mm 0.005 mm 1.9 x 3.5 mm Suitable for Welding/Soldering/ Conductive Gluing see also drawing in chapter 3 2.2 Materials Tap...
Description	HITAGTM2 Chip Module
File Size	153.68K / 22 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor Maxim Integrated Products
Part No.	MAX1546ETL
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 130 x 172 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 1.2 microns (as drawn) 1.2 microns (as drawn) 5 m...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	119.24K / 8 Page	View it Online	Download Datasheet

				MICROCHIP[Microchip Technology]
Part No.	24C02SC-_WF08 24C01SC 24C01SC-_S 24C01SC-_S08 24C01SC-_W 24C01SC-_W08 24C01SC-_WF 24C01SC-_WF08 24C01SC_04 24C02SC 24C02SC-_S 24C02SC-_S08 24C02SC-_W 24C02SC-_W08 24C02SC-_WF 24C02SC-/S08 24C02SC-/W 24C02SC-/W08 24C02SC-/WF 24C02SC-/WF08 24C01SC-/S08 24C01SC-/WF 24C01SC-/WF08 24C02SC/S08 24C01SC/WF
OCR Text	...lectrically Erasable PROMs with bondpad positions optimized for smart card applications. The devices are organized as a single block of 128 x 8-bit or 256 x 8-bit memory with a two-wire serial interface. The 24C01SC and 24C02SC also have pa...
Description	128 X 8 I2C/2-WIRE SERIAL EEPROM, UUC5 256 X 8 I2C/2-WIRE SERIAL EEPROM, UUC5 1K/2K 5.0V I2C Serial EEPROMs for Smart Cards
File Size	151.09K / 16 Page	View it Online	Download Datasheet

For bondpad Found Datasheets File :: 130 Search Time::1.11ms
Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |