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eutectic Datasheet PDF File

For eutectic Found Datasheets File :: 3744 Search Time::0.781ms
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				Filtronic Compound Semiconductors
Part No.	FPD1500P100
OCR Text	...y specification assumes a Au/Sn eutectic die attach onto a Au-plated copper heatsink or rib. * Power Dissipation defined as: PTOT (PDC + PIN) - POUT, where PDC: DC Bias Power PIN: RF Input Power POUT: RF Output Power * Absolute Maximum Pow...
Description	1W PACKAGED POWER PHEMT
File Size	179.40K / 3 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC130
OCR Text	...nd can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C an...
Description	GaAs MMIC DOUBLE-BALANCED MIXER, 6 - 11 GHz
File Size	177.26K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC156
OCR Text	...nd can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is...
Description	GaAs MMIC PASSIVE FREQUENCY DOUBLER/ 0.7 - 2.4 GHz INPUT GaAs MMIC PASSIVE FREQUENCY DOUBLER, 0.7 - 2.4 GHz INPUT
File Size	78.73K / 4 Page	View it Online	Download Datasheet

				Filtronic Compound Semi... Filtronic Compound Semiconductors
Part No.	LPS200
OCR Text	...ommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290C; maximum time at temperature is one minute. The recommended wire bond method is thermo-compression wedge bonding with 0.7 or 1...
Description	HIGH PERFORMANCE LOW NOISE PHEMT
File Size	29.33K / 2 Page	View it Online	Download Datasheet

				Micron Technology, Inc. MICRON[Micron Technology]
Part No.	MT46V32M8 MT46V16M16 MT46V64M4 MT46V32M8TG-6T MT46V64M4TG-6 MT46V64M4TG-6T MT46V64M4TG-75Z MT46V16M16TG-75Z MT46V32M8TG-75Z MT46V16M16TG-6 MT46V16M16TG-6T MT46V64M4FJ-75Z MT46V16M16FJ-6 MT46V16M16FJ-6T MT46V16M16FJ-75Z MT46V32M8FJ-6 MT46V32M8FJ-6T MT46V64M4FJ-6T MT46V32M8TG-6 MT46V32M8FJ-75Z
OCR Text	... D E SOLDER BALL MATERIAL: eutectic 63% Sn, 37% Pb or 62% Sn, 36% Pb, 2%Ag SOLDER BALL PAD: O .33mm MOLD COMPOUND: EPOXY NOVOLAC F G H FBGA PACKAGE MARKING Due to the physical size of the FBGA package, the full ordering part ...
Description	DOUBLE DATA RATE DDR SDRAM
File Size	147.04K / 8 Page	View it Online	Download Datasheet

				TriQuint Semiconductor, Inc. TRIQUINT[TriQuint Semiconductor]
Part No.	TGA1073A TGA1073A-SCC
OCR Text	...M (HRS) 1.3 E6 Note: Assumes eutectic attach using 1.5 mil thick 80/20 AuSn mounted to a 20mil CuMo Carrier at 55C baseplate temperature. Worst case condition with no RF applied, 100% of DC power is dissipated. TriQuint Semiconductor ...
Description	26- 34 GHz Medium Power Amplifier 26000 MHz - 35000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
File Size	627.06K / 7 Page	View it Online	Download Datasheet

				TriQuint Semiconductor, Inc. TriQuint Semiconductor,Inc. TRIQUINT[TriQuint Semiconductor]
Part No.	TGA1073C TGA1073C-SCC
OCR Text	...M (HRS) 2.1 E7 Note: Assumes eutectic attach using 1.5 mil thick 80/20 AuSn mounted to a 20mil CuMo Carrier at 70C baseplate temperature. Worst case condition with no RF applied, 100% of DC power is dissipated. TriQuint Semiconductor ...
Description	36 - 40 GHz Power Amplifier 36 - 40 GHz功率放大
File Size	850.13K / 6 Page	View it Online	Download Datasheet

				TRIQUINT[TriQuint Semiconductor]
Part No.	TGA1073G TGA1073G-SCC
OCR Text	...M (HRS) 1.0 E6 Note: Assumes eutectic attach using 1.5 mil 80/20 AuSn mounted to a 20mil CuMo Carrier at 55C baseplate temperature. Worst case condition with no RF applied, 100% of DC power is dissipated. TriQuint Semiconductor Texas ...
Description	19 - 27 GHz Medium Power Amplifier
File Size	584.00K / 6 Page	View it Online	Download Datasheet

For eutectic Found Datasheets File :: 3744 Search Time::0.781ms
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