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630BH023 2N605 CM421690 MMSZ523 E101M 93100 DB1CB1AA AN574
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    0702871100

Molex Electronics Ltd.
Part No. 0702871100
OCR Text ... - maximum 250v dc solder process data duration at max. process temperature (seconds) 5 lead-free process capability wave capable (th only) max. cycles at max. process temperature 1 process temperatur...
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 8 Circuits, 6.10mm (.240) Mating Pin Length, 0.38μm (15μ) Gold (Au) Selective

File Size 308.36K  /  6 Page

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    MB90V485B

Fujitsu Component Limited.
Part No. MB90V485B
OCR Text ...or microcontroller designed for process control in consumer devices and other app lications requiring high-speed real-time processing. the f 2 mc-16lx cpu core instruction set retains the at architecture of the f 2 mc* 1 family, with addit...
Description 16-bit Microcontroller

File Size 727.55K  /  124 Page

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    CP788X

Central Semiconductor Corp
Part No. CP788X
OCR Text process details principal device type cmkt5087 gross die per 5 inch wafer 91,469 process cp788x small signal transistor pnp - low noise amplifier transistor chip process epitaxial planar die size 13.7 x 13.7 mils die thickne...
Description Small Signal Transistor PNP - Low Noise Amplifier Transistor Chip

File Size 699.02K  /  2 Page

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    46409-1100

Molex Electronics Ltd.
Part No. 46409-1100
OCR Text ...ting -10c to +105c solder process data duration at max. process temperature (seconds) 40 lead-free process capability smc & wave capable (th only) max. cycles at max. process temperature 3 process ...
Description PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

File Size 61.81K  /  1 Page

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    46408-1100

Molex Electronics Ltd.
Part No. 46408-1100
OCR Text ...ting -10c to +105c solder process data duration at max. process temperature (seconds) 40 lead-free process capability smc & wave capable (th only) max. cycles at max. process temperature 3 process ...
Description PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

File Size 63.33K  /  2 Page

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    Vishay
Part No. VJX8R
OCR Text ...frequency stability ? wet build process ? reliable noble metal electrode (nme) system ? compliant to rohs directive 2002/95/ec ? halogen-free according to iec 61249-2-21 definition applications ? high temperature modules electrical specif...
Description Surface Mount Multilayer Ceramic Chip Capacitors

File Size 143.31K  /  5 Page

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    centralsemi
Part No. CPD69
OCR Text process details principal device types cmr1-02 series cmr1-02m series cxr1-04 cxr1-04c czr1-04 czr1-04c gross die per 4 inch wafer 6,200 process cpd69 general purpose rectifier 1 amp glass passivated rectifier chip process ...
Description 1 Amp Glass Passivated Rectifier Chip

File Size 415.74K  /  2 Page

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    CP757X

Central Semiconductor Corp
Part No. CP757X
OCR Text process cp757x small signal mosfet transistor p-channel enhancement-mode mosfet chip process details die size 22 x 17 mils die thickness 5.9 mils gate bonding pad area 3.9 x 3.9 mils source bonding pad area 14 x 9 mils to...
Description Small Signal MOSFET Transistor P-Channel Enhancement-Mode MOSFET Chip

File Size 738.31K  /  2 Page

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    CP379X

Central Semiconductor Corp
Part No. CP379X
OCR Text process cp379x small signal mosfet transistor n-channel enhancement-mode transistor chip process details die size 31.5 x 31.5 mils die thickness 5.5 mils gate bonding pad area 3.9 x 3.9 mils source bonding pad area 19.3 x ...
Description Small Signal MOSFET Transistor N-Channel Enhancement-Mode Transistor Chip

File Size 745.81K  /  2 Page

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