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  tsop1-32 Datasheet PDF File

For tsop1-32 Found Datasheets File :: 329    Search Time::2.203ms    
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    K6T1008C2C K6T1008C2C-B K6T1008C2C-DB55 K6T1008C2C-DB70 K6T1008C2C-DL55 K6T1008C2C-DL70 K6T1008C2C-F K6T1008C2C-GB55 K6T

Samsung semiconductor
Part No. K6T1008C2C K6T1008C2C-B K6T1008C2C-DB55 K6T1008C2C-DB70 K6T1008C2C-DL55 K6T1008C2C-DL70 K6T1008C2C-F K6T1008C2C-GB55 K6T1008C2C-GB70 K6T1008C2C-GF70 K6T1008C2C-GL55 K6T1008C2C-GL70 K6T1008C2C-GP70 K6T1008C2C-L K6T1008C2C-P K6T1008C2C-RB55 K6T1008C2C-RB70 K6T1008C2C-RF70 K6T1008C2C-TB55 K6T1008C2C-TB70 K6T1008C2C-TF70
OCR Text ...ype: 32-DIP-600, 32-SOP-525, 32-TSOP1-0820F/R CMOS SRAM GENERAL DESCRIPTION The K6T1008C2C families are fabricated by SAMSUNGs advanced CMOS process technology. The families support various operating temperature ranges and have various...
Description 128K x8 bit Low Power CMOS Static RAM

File Size 126.33K  /  10 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K8D1716UBB-YI07 K8D1716UBB-YI08 K8D1716UBB-YI09 K8D1716UTB-TC09 K8D1716UTB-TC08 K8D1716UTB-TC07 K8D1716UTB-YI09 K8D1716UTB-YI08 K8D1716UTB-YI07 K8D1716UTB-YC08 K8D1716UTB-YC09 K8D1716UTB-YC07 K8D1716UTB-TI07 K8D1716UTB-TI09 K8D1716UTB-TI08 K8D1716UBB-TC08 K8D1716UBB-TI07 K8D1716UBB-YC09 K8D1716UBB-YC07 K8D1716UBB-TC09 K8D1716UBB-TC07 K8D1716UBB-YC08 K8D1716UBB-TI08
OCR Text ...s device is available in 48 pin tsop1 package. the device is compatible with eprom applications to require high-density and cost- effective ...32 31 30 29 28 27 26 25 a15 a14 a13 a12 a11 a10 a9 a8 a19 n.c we reset n.c wp /acc ry/by a18 a17 a7 ...
Description 16M Bit (2M x8/1M x16) Dual Bank NOR Flash Memory 1,600位(200万x8/1M x16)的双银行NOR闪存

File Size 495.72K  /  40 Page

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    HYNIX[Hynix Semiconductor]
Part No. HY27US08121M HY27US16121M HY27USXXX HY27SS08121M HY27SS16121M HY27SSXXX
OCR Text ...ete Cache Program 0.6 1) Change TSOP1, WSOP1, FBGA package dimension 2) Edit TSOP1, WSOP1 package figures 3) Change FBGA package figure Oct....32 Pages x 4,096 Blocks SERIAL NUMBER OPTION HARDWARE DATA PROTECTION - Program/Erase locked dur...
Description 512Mbit (64Mx8bit / 32Mx16bit) NAND Flash

File Size 723.19K  /  43 Page

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    K6F1008V2C K6F1008V2C-F K6F1008V2C-YF55 K6F1008V2C-YF70

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Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K6F1008V2C K6F1008V2C-F K6F1008V2C-YF55 K6F1008V2C-YF70
OCR Text ...e : 48(36)-TBGA-6.00x7.00 to 32-TSOP1-0813.4F Finalize Draft Data November 27, 2001 December 13, 2001 Remark Preliminary Preliminary 1.0 June 12, 2002 Final The attached datasheets are provided by SAMSUNG Electronics. SA...
Description 128Kx8 bit Super Low Power and Low Voltage CMOS Static RAM 128Kx8位超低功耗和低电压的CMOS静态RAM

File Size 125.50K  /  9 Page

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    Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K6F2008V2E K6F2008V2E-YF70 K6F2008V2E-LF55 K6F2008V2E-LF70 K6F2008V2E-YF55
OCR Text ...ed Lead Free(LF) product for 32-TSOP1-0813.4F(LF) package. The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and products. SAMSUNG Electronics will a...
Description 256Kx8 bit Super Low Power and Low Voltage Full CMOS Static RAM 256Kx8位超低功耗和低电压的CMOS静态RAM

File Size 133.16K  /  9 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F1G08U0A
OCR Text ...n wsop1 pkg diagram . 1. pkg(tsop1, wsop1) dimension change draft date aug . 24 . 200 3 jan. 27. 2004 apr. 23. 2004 may. 19. 2004 flas...32 31 30 29 28 27 26 25 n.c n.c n.c n.c n.c n.c r/b re ce n.c n.c vcc vss n.c n.c cle ale we wp n.c...
Description FLASH MEMORY

File Size 685.20K  /  37 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F1G08D0M K9F1G16D0M K9F1G08U0M-YCB00
OCR Text ...n wsop1 pkg diagram . 1. pkg(tsop1, wsop1) dimension change draft date mar.17. 2003 apr. 9. 2003 jul. 2. 2003 aug. 5. 2003 jan. 27. 2004 ...32)bit x16bit - cache register -x8 device(k9f1g08x0m): (2k + 64)bit x8bit -x16 d...
Description Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TV07; Number of Contacts:37; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Jam Nut Receptacle; Body Style:Straight
128M x 8 Bit / 64M x 16 Bit NAND Flash Memory
128M X 8 FLASH 2.7V PROM, 30 ns, PDSO48

File Size 737.72K  /  40 Page

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    HY27UA161G1M HY27UA1G1M HY27UAXXX HY27UA081G1M HY27SAXXX HY27SA081G1M HY27SA161G1M HY27SA1G1M

HYNIX[Hynix Semiconductor]
Part No. HY27UA161G1M HY27UA1G1M HY27UAXXX HY27UA081G1M HY27SAXXX HY27SA081G1M HY27SA161G1M HY27SA1G1M
OCR Text ...ete Cache Program 0.5 1) Change TSOP1, WSOP1, FBGA package dimension 2) Edit TSOP1, WSOP1 package figures 3) Change FBGA package figure Oct....32 Pages x 8,192 Blocks SERIAL NUMBER OPTION HARDWARE DATA PROTECTION - Program/Erase locked dur...
Description 1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory

File Size 722.73K  /  43 Page

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