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  87759-0614 Datasheet PDF File

For 87759-0614 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87759-1875

Molex Electronics Ltd.
Part No. 87759-1875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 280.29K  /  6 Page

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Amphenol Communications Solutions

Part No. 98414-F06-14ULF
Description Minitek®, Board/Wire to Board Connector, 2.00mm (0, 079in), Shrouded Vertical Header, Through Hole, Double Row, 14 positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-3015

Molex Electronics Ltd.
Part No. 87759-3015
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.39K  /  6 Page

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Amphenol Communications Solutions

Part No. 10061402-10010TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    87759-7626

Molex Electronics Ltd.
Part No. 87759-7626
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 355.91K  /  6 Page

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Amphenol Communications Solutions

Part No. 54122-409061450LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 6 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87759-4275

Molex Electronics Ltd.
Part No. 87759-4275
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 280.29K  /  6 Page

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Amphenol Communications Solutions

Part No. 61082-061409LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 60 Positions.
Tech specs    

Official Product Page

    87759-1415

Molex Electronics Ltd.
Part No. 87759-1415
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.56K  /  6 Page

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Amphenol Communications Solutions

Part No. 61082-061422LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 60 Positions.
Tech specs    

Official Product Page

    87759-4274

Molex Electronics Ltd.
Part No. 87759-4274
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.12K  /  8 Page

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Amphenol Communications Solutions

Part No. 98414-G06-14U
Description Minitek®, Board/Wire to Board Connectors, Shrouded Header - Through Mount - Double row - 14 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    87759-4074

Molex Electronics Ltd.
Part No. 87759-4074
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 420.21K  /  8 Page

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Amphenol Communications Solutions

Part No. 54122-106140950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87759-4874

Molex Electronics Ltd.
Part No. 87759-4874
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.12K  /  8 Page

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Amphenol Communications Solutions

Part No. 59112-T3806-1400LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 6 Positions.
Tech specs    

Official Product Page

    87759-4075

Molex Electronics Ltd.
Part No. 87759-4075
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 279.39K  /  6 Page

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Amphenol Communications Solutions

Part No. 54111-406061450LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-3275

Molex Electronics Ltd.
Part No. 87759-3275
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.29K  /  6 Page

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Amphenol Communications Solutions

Part No. 10061404-10010TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, 140 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

For 87759-0614 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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