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  87759-2450 Datasheet PDF File

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    87759-4864

Molex Electronics Ltd.
Part No. 87759-4864
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 420.98K  /  8 Page

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Texas Instruments
Part No. 5962-8775901M2A
Description Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs 　 　

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HUA FENG CIRCUIT





    87759-4464

Molex Electronics Ltd.
Part No. 87759-4464
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 421.15K  /  8 Page

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Texas Instruments
Part No. 5962-8775901MSA
Description Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs 　 　

Official Product Page

    87759-4814

Molex Electronics Ltd.
Part No. 87759-4814
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 420.10K  /  8 Page

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Texas Instruments
Part No. 5962-8775901MRA
Description Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs 　 　

Official Product Page

    87759-1450

Molex Electronics Ltd.
Part No. 87759-1450
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 174.22K  /  4 Page

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Amphenol Communications Solutions
Part No. 10132450-0611GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    87759-2864

Molex Electronics Ltd.
Part No. 87759-2864
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 420.98K  /  8 Page

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Amphenol Communications Solutions
Part No. 54112-812262450LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87759-2865

Molex Electronics Ltd.
Part No. 87759-2865
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap
File Size 280.27K  /  6 Page

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Amphenol Communications Solutions
Part No. 61083-124506LF
Description BERGSTAK 0.8MM
Tech specs 　 　

Official Product Page

    87759-1875

Molex Electronics Ltd.
Part No. 87759-1875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap
File Size 280.29K  /  6 Page

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Amphenol Communications Solutions
Part No. 66245-020LF
Description Quickie® IDC Cable-to-Board Connector System, Backplane - Double row - 20 Positions - 2.54 mm (0.100in) .
Tech specs 　 　

Official Product Page

    87759-1814

Molex Electronics Ltd.
Part No. 87759-1814
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 420.10K  /  8 Page

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Amphenol Communications Solutions
Part No. 68482-450HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87759-1415

Molex Electronics Ltd.
Part No. 87759-1415
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 279.56K  /  6 Page

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Amphenol Communications Solutions
Part No. 10132450-2421GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 24 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    87759-4850

Molex Electronics Ltd.
Part No. 87759-4850
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free
File Size 174.11K  /  4 Page

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Amphenol Communications Solutions
Part No. 10132450-1021GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 10 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

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