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STANLEY ELECTRIC CO.,LT...
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| Part No. |
NAA105
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| OCR Text |
... pre-heating solder bath temp. dipping time 100 ? 60 s 1) the dip soldering process shall be 2 times maximum. 2) the product shall be cooled to normal temperature before the second dipping process. manual soldering conditions 265 ?... |
| Description |
Numeric Display/Case Size 22.8 x 33.0 mm
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| File Size |
290.33K /
12 Page |
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it Online |
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STANLEY ELECTRIC CO.,LT...
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| Part No. |
DNP325-4
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| OCR Text |
...ng conditions solder bath temp. dipping time 265 5 s (max.) (max.) position at least 3.0 mm away from resin body iron tip temp. soldering time and frequency 3 s 1 time 400 (max.) (max.) (max.) (30 w max.) position at least 3.0 mm awa... |
| Description |
Through-hole IRED/5 High Radiant Intensity Type
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| File Size |
171.49K /
10 Page |
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it Online |
Download Datasheet |
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TOSHIBA
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| Part No. |
TB6539FG
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| OCR Text |
...er bath temperature = 230 c *dipping time = 5 seconds *number of times = once *use of r-type flux 2. use of sn-3.0ag-0.5cu solder bath *solder bath temperature = 245 c *dipping time = 5 seconds *number of times = once *use of ... |
| Description |
Brushless motor driver IC
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| File Size |
321.59K /
20 Page |
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it Online |
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TOSHIBA
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| Part No. |
TD62309PG TD62309FG
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| OCR Text |
...der bath temperature = 230c dipping time = 5 seconds the number of times = once use of r-type flux (2) use of sn-3.0ag-0.5cu solder bath solder bath temperature = 245c dipping time = 5 seconds the number of tim... |
| Description |
Low saturation driver
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| File Size |
366.44K /
10 Page |
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it Online |
Download Datasheet |
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TOSHIBA
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| Part No. |
TB6549PG
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| OCR Text |
... solder bath temperature: 230 dipping time: 5 seconds the number of times: once use of r-type flux (2)use of sn-3.0ag-0.5cu solder bath solder bath temperature: 245 dipping time: 5 seconds the number of times: once use of r-type f... |
| Description |
Brush motor driver IC
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| File Size |
372.05K /
22 Page |
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it Online |
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Lite-On Technology Corp...
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| Part No. |
LTW-1BETBKJLCP2
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| OCR Text |
...he lens to the soldering point. dipping the lens into the solder must be avoided. do not app ly any external stress to the lead frame during sol dering while the led is at high temperature. recommen... |
| Description |
Through Hole Lamp
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| File Size |
593.30K /
11 Page |
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it Online |
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