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  ic-sm-hi-density pld Datasheet PDF File

For ic-sm-hi-density pld Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Lattice Semiconductor Corporation
http://
Lattice Semiconductor, Corp.
Part No. LC4128X LC4256ZC-45M132C1 LC4256ZC-75M132C1 LC4032ZC-35M56C LC4128ZC-42M132C1 LC4064ZC-37M132C1 LC4064ZC-5M132C1 LC4064ZC-75M132C1 LC4064ZC-75M56C LC4064ZC-37M56C LC4064ZC-5M56C LC4064ZC-5T100C LC4064ZC-75T100C LC4032ZC-35T48C LC4256ZC-75T176C LC4256ZC-45T176C LC4256ZC-75T100C LC4256ZC-45T100C LC4000B LC4512Z LC4128ZC-75M132C1 LC4000Z LC4000V LC4256V LC4384X LC4064X LC4032X LC4256X LC4128ZC-42T100C LC4032ZC-75M56C LC4032ZC-75M56I LC4032ZC-75T48C LC4064ZC-37T48C LC4032ZC-75T48I LC4032ZC-5M56C LC4032ZC-5T48C LC4128ZC-75T100C LC4064ZC-75T48C LATTICESEMICONDUCTORCORP-LC4032ZC-35T48C LC4032ZC-5T48I LC4032ZC-5M56I
Description 3.3V/2.5V/1.8V在系统可编程超快高密PDLs
3.3V/2.5V/1.8V In-System Programmable SuperFAST High density PDLs EE pld, 4.2 ns, PQFP100
3.3V/2.5V/1.8V In-System Programmable SuperFAST High density PDLs EE pld, 7.5 ns, PBGA56
3.3V/2.5V/1.8V In-System Programmable SuperFAST High density PDLs EE pld, 7.5 ns, PQFP48
3.3V/2.5V/1.8V In-System Programmable SuperFAST High density PDLs EE pld, 3.7 ns, PQFP48
3.3V/2.5V/1.8V In-System Programmable SuperFAST High density PDLs EE pld, 5 ns, PBGA56
3.3V/2.5V/1.8V In-System Programmable SuperFAST High density PDLs EE pld, 5 ns, PQFP48
3.3V/2.5V/1.8V In-System Programmable SuperFAST High density PDLs EE pld, 7.5 ns, PQFP100
   3.3V/2.5V/1.8V In-System Programmable SuperFAST High density PDLs

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    SCF10000 SCF5000 SCF7500 SCF12500 SCF2500

Semtech Corporation
Part No. SCF10000 SCF5000 SCF7500 SCF12500 SCF2500
Description High Voltage,High Density Fast Recovery Rectifier(反向电压2500V,温5℃时平均整流电流0.5A,高压,高密度,快速恢复整流器)
High Voltage,High Density Fast Recovery Rectifier(反向电压12500V,温5℃时平均整流电流0.5A,高压,高密度,快速恢复整流器)
High Voltage,High Density Fast Recovery Rectifier(反向电压7500V,温5℃时平均整流电流0.5A,高压,高密度,快速恢复整流器)
High Voltage,High Density Fast Recovery Rectifier(反向电压10000V,温5℃时平均整流电流0.5A,高压,高密度,快速恢复整流器)
High Voltage,High Density Fast Recovery Rectifier(反向电压5000V,温5℃时平均整流电流0.5A,高压,高密度,快速恢复整流器)
FAST RECOVERY HIGH VOLTAGE RECTIFIER ASSEMBLY

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    QuickLogic Corp.
Part No. QL2005 QL2005-1PQ208I QL2005-1PQ208C
Description 3.3V and 5.0V pASIC 2 FPGA combining speed, density, low cost and flexibility.
3.3V and 5.0V pASIC 2 FPGA Combining Speed, Density, Low Cost and Flexibility(高速,高可用密度,低成本、可适应性强.3V.0V pASIC 2系列场可编程逻辑器件)
3.3V and 5.0V pASICò 2 FPGA
3.3V and 5.0V pASIC 2 FPGA Combining Speed, Density, Low Cost and Flexibility(楂??锛?????瀵?害锛????????????у己??.3V??.0V pASIC 2绯诲??哄?缂???昏??ㄤ欢)

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    Bourns, Inc.
Part No. EDI3DG328V8D1 EDI3DG328V10D1
Description 8Megx32 Synchronous High Density DRAM Modules 3.3V(125MHz,3.3V,8M x32同步高密度动态RAM模块)
8Megx32 Synchronous High Density DRAM Modules 3.3V(100MHz,3.3V,8M x32同步高密度动态RAM模块) 8Megx32同步高密度DRAM模块3.300MHz的,3.3分X32号,同步高密度动态内存模块)

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    Lattice Semiconductor Corporation
Part No. ISPLSI5256VA ISPLSI5256VA-70LB208 ISPLSI5256VA-70LQ208 ISPLSI5256VA-70LB272 ISPLSI5256VA-100LB272 ISPLSI5256VA-70LB272I ISPLSI5256VA-125LQ208 ISPLSI5256VA-125LB272 ISPLSI5256VA-100LQ208 ISPLSI5256VA-100LB208 ISPLSI5256VA-125LB208
Description In-System Programmable 3.3V SuperWIDE?/a> High Density pld
In-System Programmable 3.3V SuperWIDE??High Density pld
In-System Programmable 3.3V SuperWIDEHigh Density pld

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    Renesas Electronics Corporation.
Renesas Electronics, Corp.
Part No. M38230G4-XXXFP M38230G4-XXXHP M38231G4-XXXHP M38232G4-XXXFP M38232G4-XXXHP M38233G4-XXXFP M38233G4-XXXHP M38234G4-XXXFP M38234G4-XXXHP M38235G4-XXXFP M38230G6-XXXFP M38230G6-XXXHP M38231G6-XXXFP M38231G6-XXXHP M38232G6-XXXFP M38232G6-XXXHP M38233G6-XXXFP M38233G6-XXXHP M38234G6-XXXFP M38234G6-XXXHP M38235G6-XXXFP M38235G6-XXXHP M38236G6-XXXHP M38237G6-XXXFP M38237G6-XXXHP M38238G6-XXXFP M38230G7-XXXFP M38230G7-XXXHP M38231G7-XXXFP M38231G7-XXXHP M38232G7-XXXFP M38232G7-XXXHP M38233G7-XXXFP M38233G7-XXXHP M38234G7-XXXFP M38234G7-XXXHP M38235G7-XXXFP M38235G7-XXXHP M38236G7-XXXFP M38236G7-XXXHP M38237G7-XXXFP M38237G7-XXXHP M38238G7-XXXFP M38238G7-XXXHP M38239G7-XXXFP M38239G7-XXXHP M38230G8-XXXFP M38230G8-XXXHP M38231G8-XXXFP M38231G8-XXXHP M38232G8-XXXFP M38232G8-XXXHP M38233G8-XXXFP M38233G8-XXXHP M38234G8-XXXFP M38234G8-XXXHP M38235G8-XXXFP M38235G8-XXXHP M38236G8-XXXFP M38236G8-XXXHP M38237G8-XXXFP M38237G8-XXXHP M38238G8-XXXFP M38238G8-XXXHP M38230GA-XXXFP M38230GA-XXXHP M38231GA-XXXFP M38231GA-XXXHP M38232GA-XXXFP M38232GA-XXXHP M38233GA-XXXFP M38233GA-XXXHP M38234GA-XXXFP M38234GA-XXXHP M38235GA-XXXFP M38235GA-XXXHP M38236GA-XXXFP M38236GA-XXXHP M38237GA-XXXFP M38237GA-XXXHP
Description 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 512Kb x 36; Vcc (V): 3.1 to 3.6 V
36-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 3.1 to 3.6 V
18-Mbit (512K x 36/1M x 18) Pipelined SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2 M x 18/512K x 72) Flow-Through SRAM with NoBL(TM) Architecture; Architecture: NoBL, Flow-through; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 1Mb x 72; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 512Kb x 72; Vcc (V): 3.1 to 3.6 V
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
Sync SRAM; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 1Mb x 72; Vcc (V): 3.1 to 3.6 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency); Architecture: QDR-II , 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit DDR-II SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency); Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V 单芯位CMOS微机
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V 单芯位CMOS微机
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER 单芯位CMOS微机
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 2.4 to 2.6 V 单芯位CMOS微机
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V 单芯位CMOS微机
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
36-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER 单芯8位CMOS微机
Sync SRAM; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V

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    SDHD7.5K SDHP7.5K SDHP15K SDHD15K SDHN7.5K

Semtech Corporation
Semtech, Corp.
Part No. SDHD7.5K SDHP7.5K SDHP15K SDHD15K SDHN7.5K
Description STANDARD RECOVERY HIGH VOLTAGE DOUBLER AND CENTER TAPS
High Density,High Voltage,Standard Recovery Doubler Rectifier(反向电压7500V,温5℃时平均整流电流0.4A,高密高电标准恢复倍增整流
High Density,High Voltage,Standard Recovery Center Tap Rectifier(反向电压7500V,温5℃时平均整流电流0.8A,高密高电标准恢复正中心抽头整流器)
High Density,High Voltage,Standard Recovery Center Tap Rectifier(反向电压7500V,温25℃时平均整流电流0.8A,高密高电标准恢复正中心抽头整流器)
0.8 A, 7500 V, 2 ELEMENT, SILICON, SIGNAL DIODE
High Density,High Voltage,Standard Recovery Doubler Rectifier(反向电压15000V,温25℃时平均整流电流0.4A,高密高电标准恢复倍增整流 高密度,高电压,标准恢复倍流整流(反向电5000V,温25℃时平均整流电流0.4A,高密度,高电压,标准恢复倍增整流器)

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    Cypress Semiconductor, Corp.
CYPRESS SEMICONDUCTOR CORP
Part No. CY14B104NA-ZSP20XCT CY14B104NA-ZSP20XIT CY14B104LA-BA25XC CY14B104NA-BA20XC
Description 4 Mbit (512K x 8/256K x 16) nvSRAM; Organization: 256Kb x 16; Vcc (V): 2.7 to 3.6 V; Density: 4 Mb; Package: TSOP 256K X 16 NON-VOLATILE SRAM, 20 ns, PDSO54
4 Mbit (512K x 8/256K x 16) nvSRAM; Organization: 512Kb x 8; Vcc (V): 2.7 to 3.6 V; Density: 4 Mb; Package: FBGA
4 Mbit (512K x 8/256K x 16) nvSRAM; Organization: 256Kb x 16; Vcc (V): 2.7 to 3.6 V; Density: 4 Mb; Package: FBGA

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    LATTICE SEMICONDUCTOR CORP
Part No. ISPLSI5512VE-155LF256 ISPLSI5512VE-155LB272 ISPLSI5512VE-100LB272 ISPLSI5512VE-80LB272I ISPLSI5512VE-100LF388 ISPLSI5512VE-100LB388 ISPLSI5512VE-100LF388I ISPLSI5512VE-125LF388 ISPLSI5512VE-125LF388I ISPLSI5512VE-155LF388 ISPLSI5512VE-80LF388I ISPLSI5512VE-100LB388I ISPLSI5512VE-125LB388I ISPLSI5512VE-80LB388I
Description In-system programmable 3.3V SuperWIDE high density pld. fmax 155 MHz, tpd 6.5 ns.
In-system programmable 3.3V SuperWIDE high density pld. fmax 125 MHz, tpd 7.5 ns.
EE pld, 10 ns, PBGA388
In-system programmable 3.3V SuperWIDE high density pld. fmax 100 MHz, tpd 10 ns.
In-system programmable 3.3V SuperWIDE high density pld. fmax 80 MHz, tpd 12 ns.

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    Lattice Semiconductor, Corp.
LATTICE SEMICONDUCTOR CORP
Part No. ISPLSI5256VE-125LT100I ISPLSI5256VE-100LF256I ISPLSI5256VE-100LT128 ISPLSI5256VE-100LT100 ISPLSI5256VE-100LT128I ISPLSI5256VE-100LT256I ISPLSI5256VE-100LT272 ISPLSI5256VE-100LT272I ISPLSI5256VE-125LT100 ISPLSI5256VE-125LT128 ISPLSI5256VE-125LT256 ISPLSI5256VE-125LT272 ISPLSI5256VE-165LT100 ISPLSI5256VE-100LT100I ISPLSI5256VE-125LT128I ISPLSI5256VE-125LT256I ISPLSI5256VE-125LT272I ISPLSI5256VE-165LT128 ISPLSI5256VE-165LT256 ISPLSI5256VE-165LT272 ISPLSI5256VE-80LT100I ISPLSI5256VE-80LT128I ISPLSI5256VE-80LT256I ISPLSI5256VE-80LT272I ISPLSI5256VE-100LT256
Description In-system programmable 3.3V SuperWIDE high density pld. fmax 80 MHz, tpd 12 ns.
EE pld, 10 ns, PBGA256
In-system programmable 3.3V SuperWIDE high density pld. fmax 100 MHz, tpd 10 ns.
In-system programmable 3.3V SuperWIDE high density pld. fmax 125 MHz, tpd 7.5 ns.
In-system programmable 3.3V SuperWIDE high density pld. fmax 165 MHz, tpd 6.0 ns.

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