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SEMTECH[Semtech Corporation] Semtech, Corp.
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Part No. |
SFC05-4 SFC05-4TM
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OCR Text |
...SMD) pads produce stress points near the solder mask on the PCB side that can result in solder joint cracking when exposed to extreme fatigue conditions. The recommended pad size is 0.200 10 mm with a solder mask opening of 0.350 0.025 mm... |
Description |
CSP TVS Flip Chip TVS Diode Array CSP TVS Flip Chip TVS Diode Array 总警司二极管倒装芯片抑制二极管阵
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File Size |
172.81K /
7 Page |
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it Online |
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Infineon Technologies
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Part No. |
IRMS6118
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OCR Text |
...he same voltage supply Note 2: "Near-Far Receiver Latency" is the time required for the AGC and ambient correction circuits to return to max...IR TxD 39 3 VCC TxD IRMX6118 PC87108AVJE IR RxD 38 4 RxD SD 5 GND 8
IR RxD C3=0.1 F C4=10 F 21 VCC ... |
Description |
(IRMS6118 / IRMT6118) Infrared Data Transceiver
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File Size |
479.14K /
7 Page |
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it Online |
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FUJITSU COMPONENT LTD
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Part No. |
FCN-268M036-G/2D
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OCR Text |
...n line) adjacent connector pair near end cross talk (~6.0 mv /500mv=1.2%) adjacent connector pair far end crosstalk (~3.5 mv /500mv=0.7%) aggresssor line - aggresssor line + data includes test sma connector and test boards victim line + vi... |
Description |
109 CONTACT(S), MALE, RIGHT ANGLE BOARD STACKING CONNECTOR, SURFACE MOUNT, PLUG
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File Size |
1,361.24K /
16 Page |
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it Online |
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Price and Availability
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